Abstract
This paper presents the microstructure and hardness of composite solders obtained by the addition of nanopowders of copper to a conventional solder. Copper powders-reinforced lead (Pb)-tin (Sn) composite solders were prepared by thoroughly blending nano-sized copper powders (average powder particle size 100 nm) with a powder of a eutectic solder and using a water-soluble flux. The blended solder paste was melted and allowed to re-solidify in a crucible placed on a hot plate and maintained at a constant temperature. Optical microscopy observations revealed the as-solidified microstructure of the composite solder to be altered by the addition of nanopowders to the eutectic Sn-Pb solder. The copper powders precipitated as intermetallic compounds that were non-uniformly distributed through the microstructure. Microhardness measurements revealed a 30-40% increase in hardness of the composite solder over the conventional unreinforced eutectic counterpart.
| Original language | English |
|---|---|
| Pages (from-to) | 333-338 |
| Number of pages | 6 |
| Journal | Materials Letters |
| Volume | 53 |
| Issue number | 4-5 |
| DOIs | |
| State | Published - Apr 2002 |
Keywords
- Composite solder
- Copper nanopowders
- Microhardness
- Microstructure
- Sn-Pb eutectic
Fingerprint
Dive into the research topics of 'The influence of copper nanopowders on microstructure and hardness of lead-tin solder'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver