The analysis and structural design of micro SOl pressure sensors

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

13 Scopus citations

Abstract

A kind of micro piezoresistive pressure sensor with stable performances under high temperature is designed based on the silicon on insulator (SOl). Through analyzing the stress distribution of diaphragm by finite element method (FEM), the model of structure was established. The fabrication operated on SOl wafer, which can be used in extreme high temperature environments, and applied the technology of anisotropy chemical etching. Performances of this kind of SOl piezoresistive sensor, including size, sensitivity, and temperature were investigated. The result shows that the precision is O.57% FS. Therefore, this kind of design not only has smaller size, simplicity preparation but also has high sensitivity, temperature coefficient and accuracy.

Original languageEnglish
Title of host publication4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009
Pages55-58
Number of pages4
DOIs
StatePublished - 2009
Event4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009 - Shenzhen, China
Duration: 5 Jan 20098 Jan 2009

Publication series

Name4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009

Conference

Conference4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009
Country/TerritoryChina
CityShenzhen
Period5/01/098/01/09

Keywords

  • FEM
  • High temperature
  • Pressure
  • SOI

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