TGO and Al diffusion behavior of CuAlxNiCrFe high-entropy alloys fabricated by high-speed laser cladding for TBC bond coats

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Abstract

CuAlxNiCrFe (x = 0.5, 1, 1.5, 2) high-entropy alloys (HEAs) with good high-temperature oxidation resistance were deposited as bond coats via high-speed laser cladding. The microstructure of the CuAlxNiCrFe bond coats exhibited the columnar-to-equiaxed grain transition with increasing Al content. All bond coats generated a uniform and dense aluminum oxide layer and exhibited a low thermally grown oxide (TGO) growth rate after 100 h of oxidation at 1100 °C. During oxidation, CuAl1.5NiCrFe exhibited an extremely low Al diffusion coefficient, and the grain size of CuAlNiCrFe only grew by ~20%.

Original languageEnglish
Article number109781
JournalCorrosion Science
Volume192
DOIs
StatePublished - Nov 2021

Keywords

  • Bond coat
  • CuAlxNiCrFe
  • Diffusion
  • High-entropy alloy
  • TBCs
  • TGO

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