Temperature and strain rate effects on the strength and ductility of nanostructured copper

Y. M. Wang; E. Ma

doi:10.1063/1.1618370

Temperature and strain rate effects on the strength and ductility of nanostructured copper

Y. M. Wang
, E. Ma

Johns Hopkins University

Research output: Contribution to journal › Article › peer-review

192 Scopus citations

Abstract

The temperature and strain rate dependences on the strength and ductility of nanostructured copper were shown. A thermally activated deformation mechanism was operative at room temperature and at slow strain rates. The uniform and efficient storage of dislocations led to a high strain hardening rate at low temperatures.

Original language	English
Pages (from-to)	3165-3167
Number of pages	3
Journal	Applied Physics Letters
Volume	83
Issue number	15
DOIs	https://doi.org/10.1063/1.1618370
State	Published - 13 Oct 2003
Externally published	Yes

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title = "Temperature and strain rate effects on the strength and ductility of nanostructured copper",

abstract = "The temperature and strain rate dependences on the strength and ductility of nanostructured copper were shown. A thermally activated deformation mechanism was operative at room temperature and at slow strain rates. The uniform and efficient storage of dislocations led to a high strain hardening rate at low temperatures.",

author = "Wang, \{Y. M.\} and E. Ma",

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AU - Ma, E.

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Y1 - 2003/10/13

N2 - The temperature and strain rate dependences on the strength and ductility of nanostructured copper were shown. A thermally activated deformation mechanism was operative at room temperature and at slow strain rates. The uniform and efficient storage of dislocations led to a high strain hardening rate at low temperatures.

AB - The temperature and strain rate dependences on the strength and ductility of nanostructured copper were shown. A thermally activated deformation mechanism was operative at room temperature and at slow strain rates. The uniform and efficient storage of dislocations led to a high strain hardening rate at low temperatures.

UR - https://www.scopus.com/pages/publications/0242272649

U2 - 10.1063/1.1618370

DO - 10.1063/1.1618370

M3 - 文章

AN - SCOPUS:0242272649

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VL - 83

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JO - Applied Physics Letters

JF - Applied Physics Letters

IS - 15

ER -

Temperature and strain rate effects on the strength and ductility of nanostructured copper

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