Abstract
A new class of polyimide/silica-alumina (PI/SiO2-Al 2O3) composite film was prepared by synthesizing ceramic oligomers through sol-gel reaction using tetraethoxysilane (TEOS) and heteropropyl-aluminium (HPAl) as the inorganic precursors and incorporating them into polyamic acid (PAA) derived from pyromellitic dianhydride (PMDA) and 4,4′-oxydianiline (ODA) in N,N-diethlacetanide (DMAc). The chemical structure of the hybrid polyimide film was characterized by FTIR. And the surface morphology of the film was characterized by AFM. It turned out that a kind of co-doped polyimide film containing a homogeneous dispersion of SiO2 and Al2O3 particles was obtained. And when the content of the inorganic moieties was not beyond 10 % SiO2 and 5% Al2O3 (wt%), the size of the ceramic particle was in the range of nano-level, besides, the film was golden and transparent.
| Original language | English |
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| Pages | 203-205 |
| Number of pages | 3 |
| State | Published - 2005 |
| Externally published | Yes |
| Event | 2005 International Symposium on Electrical Insulating Materials, ISEIM 2005 - Kitakyushu, Japan Duration: 5 Jun 2005 → 9 Jun 2005 |
Conference
| Conference | 2005 International Symposium on Electrical Insulating Materials, ISEIM 2005 |
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| Country/Territory | Japan |
| City | Kitakyushu |
| Period | 5/06/05 → 9/06/05 |