TY - GEN
T1 - Synthesis and characterization of corona-resistant polyimide/silica and alumina hybrid films
AU - Hong, Zhou
AU - Yong, Fan
AU - Qingquan, Lei
PY - 2005
Y1 - 2005
N2 - A new class of polyimide hybrid films with various amounts of silica and alumina has been synthesized by the sol-gel reaction and characterized. The hybrid films were obtained by the hydrolysis and polycondensation of heteropropyl-alumina and tetraethoxysilane (TEOS) in a polyamic acid (PAA) solution of N,N′-dimethylacetamide (DMAc), followed by heating to 350°C. The chemical structure and surface morphology of the composites films were characterized by Fourier Transform Infrared Spectroscopy (FTIR) and Atomic Force Microscopy (AFM). The thermal stability of the composite films was tested on a Perkin-Elmer TGA7. Thermal stability of the hybrid film was increased with the nano scale inorganic oxides. The presence of silica and alumina has a significant effect on the properties of polyimide films.
AB - A new class of polyimide hybrid films with various amounts of silica and alumina has been synthesized by the sol-gel reaction and characterized. The hybrid films were obtained by the hydrolysis and polycondensation of heteropropyl-alumina and tetraethoxysilane (TEOS) in a polyamic acid (PAA) solution of N,N′-dimethylacetamide (DMAc), followed by heating to 350°C. The chemical structure and surface morphology of the composites films were characterized by Fourier Transform Infrared Spectroscopy (FTIR) and Atomic Force Microscopy (AFM). The thermal stability of the composite films was tested on a Perkin-Elmer TGA7. Thermal stability of the hybrid film was increased with the nano scale inorganic oxides. The presence of silica and alumina has a significant effect on the properties of polyimide films.
UR - https://www.scopus.com/pages/publications/33846187308
U2 - 10.1109/EEIC.2005.1566284
DO - 10.1109/EEIC.2005.1566284
M3 - 会议稿件
AN - SCOPUS:33846187308
SN - 0780391454
SN - 9780780391451
T3 - Proceedings - Electrical Insulation Conference and Electrical Manufacturing Expo, 2005
SP - 175
EP - 177
BT - Proceedings - Electrical Insulation Conference and Electrical Manufacturing Expo, 2005
T2 - Electrical Insulation Conference and Electrical Manufacturing Expo, 2005
Y2 - 23 October 2005 through 26 October 2005
ER -