Study on the dielectric properties of polyimide/silica nanocomposite films

  • Ming Yan Zhang
  • , Shu Jin Zeng
  • , Tie Quan Dong
  • , Yong Fan
  • , Qing Quan Lei

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

In the paper, the chemical structure and dielectric properties including dielectric constant e and dielectric loss tanδ of organic-inorganic polyimide/silica composite films, made through sol-gel process and thermal imidization, using Pyromellitic dianhydride and 4, 4′-oxydianiline as organic precursors and Methyltriethoxysilane as inorganic precursor, were investigated. A coupling agent of 3-aminopropyl triethoxysilane was added in order to improve the compatibility between polyimide and inorganic phase. It turned out that the properties of films were not only relative to the inorganic content of the system, but also to the morphology of the phases and the characteristics of the interface between polyimide and the inorganic.

Original languageEnglish
Title of host publicationProceedings of ICPADM 2006 - 8th International Conference on Properties and Applications of Dielectric Materials
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages733-735
Number of pages3
ISBN (Print)1424401895, 9781424401895
DOIs
StatePublished - 2006
Externally publishedYes
EventICPADM 2006 - 8th International Conference on Properties and Applications of Dielectric Materials - Bali, Indonesia
Duration: 26 Jun 200630 Jun 2006

Publication series

NameProceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials

Conference

ConferenceICPADM 2006 - 8th International Conference on Properties and Applications of Dielectric Materials
Country/TerritoryIndonesia
CityBali
Period26/06/0630/06/06

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