TY - GEN
T1 - Study on optimizing material parameters in the acoustic-vibration sensors isolation packaging system
AU - Jinghua, Yin
AU - Guangjun, Lu
AU - Chunqing, Gong
AU - Xiaowei, Liu
AU - Qingquan, Lei
PY - 2005
Y1 - 2005
N2 - The acoustic -vibration sensors system is a kind of MEMS devices, which has a potential application prospect, and its packaging plays key part in the fabrication process. The double J-like package model for isolating the acoustic sensor has been chosen while packaging the acoustic-vibration sensors system in this paper. By using the finite element analysis software ANSYS 5.7, modal analysis has been applied on the package model to analyze the relationship between the isolating material parameters and the natural frequencies of the model, which is the key physical quantity for isolation. The results show that the first three natural frequencies increase with the increase of the Young's modulus Y of the isolating material rubber, and they don't change evidently when the Poisson's ration μ increase and they decrease with the increase of Density ρ. The optimized material parameters have been gained: Y=1.0 × 106 N/m2, μ=0.49and ρ =1.2X103kg/m 3.
AB - The acoustic -vibration sensors system is a kind of MEMS devices, which has a potential application prospect, and its packaging plays key part in the fabrication process. The double J-like package model for isolating the acoustic sensor has been chosen while packaging the acoustic-vibration sensors system in this paper. By using the finite element analysis software ANSYS 5.7, modal analysis has been applied on the package model to analyze the relationship between the isolating material parameters and the natural frequencies of the model, which is the key physical quantity for isolation. The results show that the first three natural frequencies increase with the increase of the Young's modulus Y of the isolating material rubber, and they don't change evidently when the Poisson's ration μ increase and they decrease with the increase of Density ρ. The optimized material parameters have been gained: Y=1.0 × 106 N/m2, μ=0.49and ρ =1.2X103kg/m 3.
UR - https://www.scopus.com/pages/publications/33846280097
U2 - 10.1109/ICEPT.2005.1564742
DO - 10.1109/ICEPT.2005.1564742
M3 - 会议稿件
AN - SCOPUS:33846280097
SN - 0780394496
SN - 9780780394490
T3 - 2005 6th International Conference on Electronics Packaging Technology
BT - 2005 6th International Conference on Electronics Packaging Technology
T2 - 2005 6th International Conference on Electronics Packaging Technology
Y2 - 30 August 2005 through 2 September 2005
ER -