TY - GEN
T1 - Study on electrical properties of micro-nano structured epoxy composites
AU - Guo, Jielin
AU - Chen, Yu
AU - Jia, Zirui
AU - Tanaka, Toshikatsu
AU - Wu, Jielong
AU - Cheng, Yonghong
PY - 2014
Y1 - 2014
N2 - With the aim of reducing the insulation faults in GIS and achieving the purpose of GIS device miniaturization, it is very important to develop a new type insulation material. In this paper, the micro-nano Al2O 3/Epoxy composites were proposed, and its dielectric breakdown strength was investigated. Nano-flllers and micro-fillers (α-Al 2O3 with a purity of 99.9%, particle size range at 12∼21 μm for micro fillers, and average particle size with 30 nm for nano fillers) were dispersed in the epoxy resin with shear force and ultrasonic vibration. The specimens were produced by a curing reaction with the hardener. Six kinds of material were prepared for this investigation, which were neat epoxy, nano-composite (loaded with 5 wt% nano-Al2O3 fillers), nano-composite (loaded with 5 wt% nano-TiO2 fillers),micro-composite (loaded with 65 wt% micro-Al2O3 fillers), nano-micro-mixture-composites (loaded with 2 wt% nano-Al 2O3 fillers and 63 wt% micro-Al2O3 fillers), nano-micro-mixture-composites (loaded with 2 wt% nano-TiO2 fillers and 63 wt% micro-Al2O3 fillers). Dispersion of the micro and nano Al2O3 in the epoxy resin was observed through SEM, and thermal behavior was analyzed with Thermo-Gravimetric Analysis (TGA) and differential scanning calorimeter (DSC). The dielectric constant and dielectric loss were measured by broadband dielectric spectrum test facility. Dielectric breakdown experiments were carried out through the sphere-plate sample-sphere configuration under AC voltage.
AB - With the aim of reducing the insulation faults in GIS and achieving the purpose of GIS device miniaturization, it is very important to develop a new type insulation material. In this paper, the micro-nano Al2O 3/Epoxy composites were proposed, and its dielectric breakdown strength was investigated. Nano-flllers and micro-fillers (α-Al 2O3 with a purity of 99.9%, particle size range at 12∼21 μm for micro fillers, and average particle size with 30 nm for nano fillers) were dispersed in the epoxy resin with shear force and ultrasonic vibration. The specimens were produced by a curing reaction with the hardener. Six kinds of material were prepared for this investigation, which were neat epoxy, nano-composite (loaded with 5 wt% nano-Al2O3 fillers), nano-composite (loaded with 5 wt% nano-TiO2 fillers),micro-composite (loaded with 65 wt% micro-Al2O3 fillers), nano-micro-mixture-composites (loaded with 2 wt% nano-Al 2O3 fillers and 63 wt% micro-Al2O3 fillers), nano-micro-mixture-composites (loaded with 2 wt% nano-TiO2 fillers and 63 wt% micro-Al2O3 fillers). Dispersion of the micro and nano Al2O3 in the epoxy resin was observed through SEM, and thermal behavior was analyzed with Thermo-Gravimetric Analysis (TGA) and differential scanning calorimeter (DSC). The dielectric constant and dielectric loss were measured by broadband dielectric spectrum test facility. Dielectric breakdown experiments were carried out through the sphere-plate sample-sphere configuration under AC voltage.
KW - Epoxy Composite
KW - Insulation Property
KW - Power Frequency Breakdown Voltage
KW - Thermal Stability
UR - https://www.scopus.com/pages/publications/84906539717
U2 - 10.1109/ISEIM.2014.6870813
DO - 10.1109/ISEIM.2014.6870813
M3 - 会议稿件
AN - SCOPUS:84906539717
SN - 9784886860866
T3 - Proceedings of the International Symposium on Electrical Insulating Materials
SP - 441
EP - 444
BT - Proceedings of 2014 International Symposium on Electrical Insulating Materials, ISEIM 2014
PB - Institute of Electrical Engineers of Japan
T2 - 2014 International Symposium on Electrical Insulating Materials, ISEIM 2014
Y2 - 1 June 2014 through 5 June 2014
ER -