TY - GEN
T1 - Structure Optimization Analysis of MEMS Microphone Packaging Shell
AU - Li, Jiazhu
AU - Zhang, Shiwang
AU - Qin, Shaohui
AU - Yuan, Jiawei
AU - Li, Zixuan
AU - Yuan, Zheng
AU - Zhao, Zilong
AU - Luo, Ruiyan
AU - Tan, Hongqiang
AU - Zhao, Yihe
AU - Lif, Jie
AU - Gao, Wendi
AU - Li, Zhikang
AU - Zhao, Libo
N1 - Publisher Copyright:
© 2024 SPIE.
PY - 2024
Y1 - 2024
N2 - Due to compact size, high consistency, and resistance to radio frequency interference, MEMS microphones are increasingly important in the consumer electronics market and have driven the development of intelligent applications. There is a growing demand for enhanced performance in MEMS microphones. Currently, research on the shell design of MEMS microphones is relatively shallow, often only considering the accommodation of the vibrating diaphragm and ASIC chip, as well as the minimization of volume, without focusing on the impact of the shell configuration on the microphone's acoustic performance. Therefore, this paper starts from the perspective of optimizing acoustic response and studies the impact of the packaging shell configuration and design parameters of MEMS microphones on the microphone's sensitivity and frequency response, including the sound collection hole diameter, chamber volume, and chip layout. The goal is to establish a quantitative relationship between these key parameters and the microphone's performance. Simulation software was used to simulate the acoustic characteristics of the microphone shell, and optimal design parameters were recommended based on the simulation results. In addition, the research also proposes methods to adjust the frequency response of the microphone within the target frequency range, providing a reference direction for the scientific design of the shell structure to reduce the transmission loss of acoustic energy and enhance response sensitivity.
AB - Due to compact size, high consistency, and resistance to radio frequency interference, MEMS microphones are increasingly important in the consumer electronics market and have driven the development of intelligent applications. There is a growing demand for enhanced performance in MEMS microphones. Currently, research on the shell design of MEMS microphones is relatively shallow, often only considering the accommodation of the vibrating diaphragm and ASIC chip, as well as the minimization of volume, without focusing on the impact of the shell configuration on the microphone's acoustic performance. Therefore, this paper starts from the perspective of optimizing acoustic response and studies the impact of the packaging shell configuration and design parameters of MEMS microphones on the microphone's sensitivity and frequency response, including the sound collection hole diameter, chamber volume, and chip layout. The goal is to establish a quantitative relationship between these key parameters and the microphone's performance. Simulation software was used to simulate the acoustic characteristics of the microphone shell, and optimal design parameters were recommended based on the simulation results. In addition, the research also proposes methods to adjust the frequency response of the microphone within the target frequency range, providing a reference direction for the scientific design of the shell structure to reduce the transmission loss of acoustic energy and enhance response sensitivity.
KW - Acoustic Performance
KW - Finite Element Simulation
KW - MEMS Microphones
KW - Structural Parameters
UR - https://www.scopus.com/pages/publications/85209908999
U2 - 10.1117/12.3055244
DO - 10.1117/12.3055244
M3 - 会议稿件
AN - SCOPUS:85209908999
T3 - Proceedings of SPIE - The International Society for Optical Engineering
BT - Third International Conference on New Materials, Machinery, and Vehicle Engineering, NMMVE 2024
A2 - Xu, Jinyang
A2 - Davim, J. Paulo
PB - SPIE
T2 - 3rd International Conference on New Materials, Machinery, and Vehicle Engineering, NMMVE 2024
Y2 - 19 July 2024 through 21 July 2024
ER -