Structure Optimization Analysis of MEMS Microphone Packaging Shell

  • Jiazhu Li
  • , Shiwang Zhang
  • , Shaohui Qin
  • , Jiawei Yuan
  • , Zixuan Li
  • , Zheng Yuan
  • , Zilong Zhao
  • , Ruiyan Luo
  • , Hongqiang Tan
  • , Yihe Zhao
  • , Jie Lif
  • , Wendi Gao
  • , Zhikang Li
  • , Libo Zhao

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Due to compact size, high consistency, and resistance to radio frequency interference, MEMS microphones are increasingly important in the consumer electronics market and have driven the development of intelligent applications. There is a growing demand for enhanced performance in MEMS microphones. Currently, research on the shell design of MEMS microphones is relatively shallow, often only considering the accommodation of the vibrating diaphragm and ASIC chip, as well as the minimization of volume, without focusing on the impact of the shell configuration on the microphone's acoustic performance. Therefore, this paper starts from the perspective of optimizing acoustic response and studies the impact of the packaging shell configuration and design parameters of MEMS microphones on the microphone's sensitivity and frequency response, including the sound collection hole diameter, chamber volume, and chip layout. The goal is to establish a quantitative relationship between these key parameters and the microphone's performance. Simulation software was used to simulate the acoustic characteristics of the microphone shell, and optimal design parameters were recommended based on the simulation results. In addition, the research also proposes methods to adjust the frequency response of the microphone within the target frequency range, providing a reference direction for the scientific design of the shell structure to reduce the transmission loss of acoustic energy and enhance response sensitivity.

Original languageEnglish
Title of host publicationThird International Conference on New Materials, Machinery, and Vehicle Engineering, NMMVE 2024
EditorsJinyang Xu, J. Paulo Davim
PublisherSPIE
ISBN (Electronic)9781510686267
DOIs
StatePublished - 2024
Event3rd International Conference on New Materials, Machinery, and Vehicle Engineering, NMMVE 2024 - Dalian, China
Duration: 19 Jul 202421 Jul 2024

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume13420
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

Conference3rd International Conference on New Materials, Machinery, and Vehicle Engineering, NMMVE 2024
Country/TerritoryChina
CityDalian
Period19/07/2421/07/24

Keywords

  • Acoustic Performance
  • Finite Element Simulation
  • MEMS Microphones
  • Structural Parameters

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