Stretchable and deformable macroelectronics

S. Wagner; S. P. Lacour; P. H.I. Hsu; J. C. Sturm; Z. Suo

doi:10.1109/DRC.2003.1226929

Stretchable and deformable macroelectronics

S. Wagner
, S. P. Lacour
, P. H.I. Hsu
, J. C. Sturm
, Z. Suo

Princeton University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Scopus citations

Abstract

In this paper explained about the fabrication and evolution of integrated circuit. Here focusses an electronic skin and its components: the thin film, transistor backplane, the chemical sensor functional frontplane, and the computation and communication network. To date most work has gone into the backplane, some into exploring new functions., and little into circuit and network architectures.

Original language	English
Title of host publication	61st Device Research Conference, DRC 2003 - Conference Digest
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	195-197
Number of pages	3
ISBN (Electronic)	0780377273
DOIs	https://doi.org/10.1109/DRC.2003.1226929
State	Published - 2003
Externally published	Yes
Event	61st Device Research Conference, DRC 2003 - Salt Lake City, United States Duration: 23 Jun 2003 → 25 Jun 2003

Publication series

Name	Device Research Conference - Conference Digest, DRC
Volume	2003-January
ISSN (Print)	1548-3770

Conference

Conference	61st Device Research Conference, DRC 2003
Country/Territory	United States
City	Salt Lake City
Period	23/06/03 → 25/06/03

Keywords

Backplanes
Chemical sensors
Communication networks
Computer architecture
Computer networks
Fabrication
Skin
Thin film circuits
Thin film sensors
Thin film transistors

Access to Document

10.1109/DRC.2003.1226929

Cite this

Wagner, S., Lacour, S. P., Hsu, P. H. I., Sturm, J. C., & Suo, Z. (2003). Stretchable and deformable macroelectronics. In 61st Device Research Conference, DRC 2003 - Conference Digest (pp. 195-197). Article 1226929 (Device Research Conference - Conference Digest, DRC; Vol. 2003-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/DRC.2003.1226929

@inproceedings{a1b1446b62bf4029a94a10858e03644c,

title = "Stretchable and deformable macroelectronics",

abstract = "In this paper explained about the fabrication and evolution of integrated circuit. Here focusses an electronic skin and its components: the thin film, transistor backplane, the chemical sensor functional frontplane, and the computation and communication network. To date most work has gone into the backplane, some into exploring new functions., and little into circuit and network architectures.",

keywords = "Backplanes, Chemical sensors, Communication networks, Computer architecture, Computer networks, Fabrication, Skin, Thin film circuits, Thin film sensors, Thin film transistors",

author = "S. Wagner and Lacour, \{S. P.\} and Hsu, \{P. H.I.\} and Sturm, \{J. C.\} and Z. Suo",

note = "Publisher Copyright: {\textcopyright} 2003 IEEE.; 61st Device Research Conference, DRC 2003 ; Conference date: 23-06-2003 Through 25-06-2003",

year = "2003",

doi = "10.1109/DRC.2003.1226929",

language = "英语",

series = "Device Research Conference - Conference Digest, DRC",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "195--197",

booktitle = "61st Device Research Conference, DRC 2003 - Conference Digest",

}

Wagner, S, Lacour, SP, Hsu, PHI, Sturm, JC & Suo, Z 2003, Stretchable and deformable macroelectronics. in 61st Device Research Conference, DRC 2003 - Conference Digest., 1226929, Device Research Conference - Conference Digest, DRC, vol. 2003-January, Institute of Electrical and Electronics Engineers Inc., pp. 195-197, 61st Device Research Conference, DRC 2003, Salt Lake City, United States, 23/06/03. https://doi.org/10.1109/DRC.2003.1226929

Stretchable and deformable macroelectronics. / Wagner, S.; Lacour, S. P.; Hsu, P. H.I. et al.
61st Device Research Conference, DRC 2003 - Conference Digest. Institute of Electrical and Electronics Engineers Inc., 2003. p. 195-197 1226929 (Device Research Conference - Conference Digest, DRC; Vol. 2003-January).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Stretchable and deformable macroelectronics

AU - Wagner, S.

AU - Lacour, S. P.

AU - Hsu, P. H.I.

AU - Sturm, J. C.

AU - Suo, Z.

PY - 2003

Y1 - 2003

N2 - In this paper explained about the fabrication and evolution of integrated circuit. Here focusses an electronic skin and its components: the thin film, transistor backplane, the chemical sensor functional frontplane, and the computation and communication network. To date most work has gone into the backplane, some into exploring new functions., and little into circuit and network architectures.

AB - In this paper explained about the fabrication and evolution of integrated circuit. Here focusses an electronic skin and its components: the thin film, transistor backplane, the chemical sensor functional frontplane, and the computation and communication network. To date most work has gone into the backplane, some into exploring new functions., and little into circuit and network architectures.

KW - Backplanes

KW - Chemical sensors

KW - Communication networks

KW - Computer architecture

KW - Computer networks

KW - Fabrication

KW - Skin

KW - Thin film circuits

KW - Thin film sensors

KW - Thin film transistors

UR - https://www.scopus.com/pages/publications/84942586452

U2 - 10.1109/DRC.2003.1226929

DO - 10.1109/DRC.2003.1226929

M3 - 会议稿件

AN - SCOPUS:84942586452

T3 - Device Research Conference - Conference Digest, DRC

SP - 195

EP - 197

BT - 61st Device Research Conference, DRC 2003 - Conference Digest

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 61st Device Research Conference, DRC 2003

Y2 - 23 June 2003 through 25 June 2003

ER -

Stretchable and deformable macroelectronics

Abstract

Publication series

Conference

Keywords

Access to Document

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