Skip to main navigation Skip to search Skip to main content

Stress study on different designs of ceramic high temperature heat exchangers

  • Xi'an Jiaotong University

Research output: Contribution to conferencePaperpeer-review

Abstract

The thermal stress performances of common and new designed ceramic plate heat exchangers are presented. The maximum thermal stress was found on the corners and connection regions. Some structure modifications were proposed for the common plate designs to protect its joint regions and the cracks were predicted to generate initially at the outer surface of the primary surface plate. In offset bubbles primary surface plate, the maximum stress was found in the connection regions of bubbles. The outer surface of the primary surface plate and offset bubbles plate had the maximum tensile tress. This is an abstract of a paper presented at the CHISA 2012 - 20th International Congress of Chemical and Process Engineering and PRES 2012 - 15th Conference on Process Integration, Modelling and Optimisation for Energy Saving and Pollution Reduction (Prague, Czech Republic 8/25-29/2012).

Conference

Conference20th International Congress of Chemical and Process Engineering, CHISA 2012 and 15th Conference on Process Integration, Modelling and Optimisation for Energy Saving and Pollution Reduction, PRES 2012
Country/TerritoryCzech Republic
CityPrague
Period25/08/1229/08/12

Fingerprint

Dive into the research topics of 'Stress study on different designs of ceramic high temperature heat exchangers'. Together they form a unique fingerprint.

Cite this