Spallation of a substrate by thermal shock and thermal expansion differential during splat cooling

  • W. Liu
  • , G. X. Wang
  • , E. F. Matthys

Research output: Contribution to journalConference articlepeer-review

Abstract

The relationship of spallation to the time dependent heat transfer of the splat and the substrate was studied. Video and synchronized acoustic measurements were conducted to record the substrate spallation. The fracture process and mechanisms were also evaluated. The thermal contact coefficient was analyzed by matching the measured temperature valued with results from a heat conduction model with phase change. The spall formation mechanism was quantified by analyzing the geometric configuration of the splats and spalls under varying conditions of droplet superheat, droplet size, and droplet or substrate material.

Original languageEnglish
Pages (from-to)21-29
Number of pages9
JournalAmerican Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
Volume289
StatePublished - 1994
EventProceedings of the 1994 International Mechanical Engineering Congress and Exposition - Chicago, IL, USA
Duration: 6 Nov 199411 Nov 1994

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