Skin thermal pain modeling-A holistic method

  • F. Xu
  • , T. J. Lu
  • , K. A. Seffen

Research output: Contribution to journalArticlepeer-review

42 Scopus citations

Abstract

Pain sensation has been studied extensively, over a range of scales, from the molecular level to the entire human neural system. Thermal stimulation of pain has been widely used in the study of pain sensation. Skin thermal pain is induced through both direct (an increase/decrease in temperature) and indirect (thermomechanical and thermochemical) ways, and is governed by complicated thermomechanical-chemical-neurophysiologic responses. This paper is focused on the theoretical modeling of the underlying mechanisms in the process of skin thermal pain. A holistic model has been developed, which is composed of three sub-models, namely, transduction, transmission, and modulation and perception. The model can contribute to the understanding of thermally related pain phenomena in skin tissue and to improvements in a range of thermal therapeutic methods.

Original languageEnglish
Pages (from-to)223-237
Number of pages15
JournalJournal of Thermal Biology
Volume33
Issue number4
DOIs
StatePublished - May 2008
Externally publishedYes

Keywords

  • Holistic model
  • Modulation
  • Perception
  • Skin tissue
  • Thermal pain
  • Thermomechanical model
  • Transduction
  • Transmission

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