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Simulation on Bending Characteristics of Spiral-Structured Profile Conductor Cable

  • Xi'an Jiaotong University
  • Ltd.

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

With the increasing demand for electricity and the accelerated construction of power grids, traditional circular compacted conductor cable, due to the monofilament gaps, result in larger cross-sections, which limits its application. By optimizing the conductor structure and adopting fan-shaped, Z-shaped and other types of profiled stranding technology, the profile cable realizes the effect of energy saving and consumption reduction. To investigate the mechanical properties and structural characteristics of profiled conductor during the processes of being wound onto the cable drum, unwound from the cable drum, and routine laying. We established a threedimensional helical structure simulation model of profiled conductor, analyzed the bending stress distribution and wire compactness of profiled conductor under different pitches, compaction coefficients and aspect ratio. We also compared with circular compacted conductor. The aim is to provide theoretical basis and technical support for manufacturers in optimizing conductor structures. The results indicated that the pitch of the profiled conductor should be moderate, and the length should be controlled at about 20 times of the conductor diameter; The compaction coefficient significantly influences the bending performance, and the different gap sizes between monofilament will lead to regular changes in stress; When the aspect ratio of the monofilament is about 1.4, the stress distribution of the conductor is uniform and the monofilament is compact; The bending stress of the profiled conductor is lower than that of the circular compacted conductor, however, in terms of the tightness of the monofilament, the profile conductor is not as good as the circular compacted conductor.

Original languageEnglish
Title of host publication2025 IEEE 5th International Conference on Electrical Materials and Power Equipment, ICEMPE 2025
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798331537524
DOIs
StatePublished - 2025
Event5th IEEE International Conference on Electrical Materials and Power Equipment, ICEMPE 2025 - Harbin, China
Duration: 3 Aug 20256 Aug 2025

Publication series

Name2025 IEEE 5th International Conference on Electrical Materials and Power Equipment, ICEMPE 2025

Conference

Conference5th IEEE International Conference on Electrical Materials and Power Equipment, ICEMPE 2025
Country/TerritoryChina
CityHarbin
Period3/08/256/08/25

Keywords

  • bending
  • cable
  • profiled conductor
  • simulation

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