TY - GEN
T1 - Simulation of magnetic field under spiral-type contacts
AU - Dingyu, Feng
AU - Shixin, Xiu
AU - Gang, Liu
AU - Zhiheng, Sun
AU - Jiahuan, Zheng
N1 - Publisher Copyright:
© 2014 IEEE.
PY - 2014/11/18
Y1 - 2014/11/18
N2 - In IMs paper, magnetic Geld characteristics in spiral-type transverse magnetic field (TMF) contacts were studied through simulation.3D finite element models of spiral-type TMF contacts were built. In order to find out the influence of breaking currents and structural parameters on magnetic blow force and B-field, models with different breaking currents and other structural parameters such as slot width and gap distance were simulated. As the arc column moved on the contact, the calculation of magnetic blow force and B-field was also carried out, and the relationship between magnetic blow force, B-field and the position of arc column was investigated. The results in this paper could provide some information for further research on the TMF vacuum arc and the product development of spiral-type TMF contacts.
AB - In IMs paper, magnetic Geld characteristics in spiral-type transverse magnetic field (TMF) contacts were studied through simulation.3D finite element models of spiral-type TMF contacts were built. In order to find out the influence of breaking currents and structural parameters on magnetic blow force and B-field, models with different breaking currents and other structural parameters such as slot width and gap distance were simulated. As the arc column moved on the contact, the calculation of magnetic blow force and B-field was also carried out, and the relationship between magnetic blow force, B-field and the position of arc column was investigated. The results in this paper could provide some information for further research on the TMF vacuum arc and the product development of spiral-type TMF contacts.
UR - https://www.scopus.com/pages/publications/84919385860
U2 - 10.1109/DEIV.2014.6961645
DO - 10.1109/DEIV.2014.6961645
M3 - 会议稿件
AN - SCOPUS:84919385860
T3 - Proceedings - International Symposium on Discharges and Electrical Insulation in Vacuum, ISDEIV
SP - 165
EP - 168
BT - ISDEIV 2014 - Proceedings of the 26th International Symposium on Discharges and Electrical Insulation in Vacuum
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 26th International Symposium on Discharges and Electrical Insulation in Vacuum, ISDEIV 2014
Y2 - 28 September 2014 through 3 October 2014
ER -