Simulation of Interpolated Heat Dissipation Structures Using Fins and Water-cooling for Solid Medium Frequency Transformer

Diqin Ma; Weiwang Wang; Jiefeng He; Shengtao Li

doi:10.1109/CIEEC54735.2022.9846532

Simulation of Interpolated Heat Dissipation Structures Using Fins and Water-cooling for Solid Medium Frequency Transformer

Diqin Ma
, Weiwang Wang
, Jiefeng He
, Shengtao Li

School of Electrical Engineering

Xi'an Jiaotong University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

Medium/high-frequency transformer (MFT/HFT) is an essential device in solid-state transformer (SST), connecting the medium and low voltages for flexible power distribution network application. Tremendous heating generated by significant power loss in MFT is one of the key issues for high voltage and high power SST operation. This paper focuses on the influence of heat dissipation structures on the temperature rise in a 10kW/10kHz MFT used for a 10 kV SST prototype. A newly interpolated structure using an aluminum sheet with fins or a water-cooling panel was proposed. Power losses from the core, windings, and insulation were calculated using finite element method simulation by considering high frequency and harmonics. After that, the thermal heating, combined with the fluid dynamics was simulated to obtain the temperature distribution in the MFT. It pointed out that the temperature is reduced by 25°C by interpolating the aluminum sheet with fins, especially for the forced air-cooling. Water cooling structure exhibits a better effect for decreasing the temperature rise. An enhancement of heat conduction near the water entrance is ascribed to the temperature gradient and the vortex effect. It can be concluded that the interpolated aluminum sheet with fins presents great potential application due to its simplicity.

Original language	English
Title of host publication	Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	2418-2423
Number of pages	6
ISBN (Electronic)	9781665411042
DOIs	https://doi.org/10.1109/CIEEC54735.2022.9846532
State	Published - 2022
Event	5th IEEE International Electrical and Energy Conference, CIEEC 2022 - Nanjing, China Duration: 27 May 2022 → 29 May 2022

Publication series

Name	Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022

Conference

Conference	5th IEEE International Electrical and Energy Conference, CIEEC 2022
Country/Territory	China
City	Nanjing
Period	27/05/22 → 29/05/22

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 7 Affordable and Clean Energy

Keywords

MFT
heat dissipation structure
heat flux
hot spot temperature
power loss

Access to Document

10.1109/CIEEC54735.2022.9846532

Cite this

Ma, D., Wang, W., He, J., & Li, S. (2022). Simulation of Interpolated Heat Dissipation Structures Using Fins and Water-cooling for Solid Medium Frequency Transformer. In Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022 (pp. 2418-2423). (Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CIEEC54735.2022.9846532

Ma, Diqin ; Wang, Weiwang ; He, Jiefeng et al. / Simulation of Interpolated Heat Dissipation Structures Using Fins and Water-cooling for Solid Medium Frequency Transformer. Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022. Institute of Electrical and Electronics Engineers Inc., 2022. pp. 2418-2423 (Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022).

@inproceedings{00c13cb1d632431badc4f9bf1da78c7e,

title = "Simulation of Interpolated Heat Dissipation Structures Using Fins and Water-cooling for Solid Medium Frequency Transformer",

abstract = "Medium/high-frequency transformer (MFT/HFT) is an essential device in solid-state transformer (SST), connecting the medium and low voltages for flexible power distribution network application. Tremendous heating generated by significant power loss in MFT is one of the key issues for high voltage and high power SST operation. This paper focuses on the influence of heat dissipation structures on the temperature rise in a 10kW/10kHz MFT used for a 10 kV SST prototype. A newly interpolated structure using an aluminum sheet with fins or a water-cooling panel was proposed. Power losses from the core, windings, and insulation were calculated using finite element method simulation by considering high frequency and harmonics. After that, the thermal heating, combined with the fluid dynamics was simulated to obtain the temperature distribution in the MFT. It pointed out that the temperature is reduced by 25°C by interpolating the aluminum sheet with fins, especially for the forced air-cooling. Water cooling structure exhibits a better effect for decreasing the temperature rise. An enhancement of heat conduction near the water entrance is ascribed to the temperature gradient and the vortex effect. It can be concluded that the interpolated aluminum sheet with fins presents great potential application due to its simplicity.",

keywords = "MFT, heat dissipation structure, heat flux, hot spot temperature, power loss",

author = "Diqin Ma and Weiwang Wang and Jiefeng He and Shengtao Li",

note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 5th IEEE International Electrical and Energy Conference, CIEEC 2022 ; Conference date: 27-05-2022 Through 29-05-2022",

year = "2022",

doi = "10.1109/CIEEC54735.2022.9846532",

language = "英语",

series = "Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "2418--2423",

booktitle = "Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022",

}

Ma, D, Wang, W, He, J & Li, S 2022, Simulation of Interpolated Heat Dissipation Structures Using Fins and Water-cooling for Solid Medium Frequency Transformer. in Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022. Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022, Institute of Electrical and Electronics Engineers Inc., pp. 2418-2423, 5th IEEE International Electrical and Energy Conference, CIEEC 2022, Nanjing, China, 27/05/22. https://doi.org/10.1109/CIEEC54735.2022.9846532

Simulation of Interpolated Heat Dissipation Structures Using Fins and Water-cooling for Solid Medium Frequency Transformer. / Ma, Diqin; Wang, Weiwang; He, Jiefeng et al.
Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022. Institute of Electrical and Electronics Engineers Inc., 2022. p. 2418-2423 (Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Simulation of Interpolated Heat Dissipation Structures Using Fins and Water-cooling for Solid Medium Frequency Transformer

AU - Ma, Diqin

AU - Wang, Weiwang

AU - He, Jiefeng

AU - Li, Shengtao

PY - 2022

Y1 - 2022

N2 - Medium/high-frequency transformer (MFT/HFT) is an essential device in solid-state transformer (SST), connecting the medium and low voltages for flexible power distribution network application. Tremendous heating generated by significant power loss in MFT is one of the key issues for high voltage and high power SST operation. This paper focuses on the influence of heat dissipation structures on the temperature rise in a 10kW/10kHz MFT used for a 10 kV SST prototype. A newly interpolated structure using an aluminum sheet with fins or a water-cooling panel was proposed. Power losses from the core, windings, and insulation were calculated using finite element method simulation by considering high frequency and harmonics. After that, the thermal heating, combined with the fluid dynamics was simulated to obtain the temperature distribution in the MFT. It pointed out that the temperature is reduced by 25°C by interpolating the aluminum sheet with fins, especially for the forced air-cooling. Water cooling structure exhibits a better effect for decreasing the temperature rise. An enhancement of heat conduction near the water entrance is ascribed to the temperature gradient and the vortex effect. It can be concluded that the interpolated aluminum sheet with fins presents great potential application due to its simplicity.

AB - Medium/high-frequency transformer (MFT/HFT) is an essential device in solid-state transformer (SST), connecting the medium and low voltages for flexible power distribution network application. Tremendous heating generated by significant power loss in MFT is one of the key issues for high voltage and high power SST operation. This paper focuses on the influence of heat dissipation structures on the temperature rise in a 10kW/10kHz MFT used for a 10 kV SST prototype. A newly interpolated structure using an aluminum sheet with fins or a water-cooling panel was proposed. Power losses from the core, windings, and insulation were calculated using finite element method simulation by considering high frequency and harmonics. After that, the thermal heating, combined with the fluid dynamics was simulated to obtain the temperature distribution in the MFT. It pointed out that the temperature is reduced by 25°C by interpolating the aluminum sheet with fins, especially for the forced air-cooling. Water cooling structure exhibits a better effect for decreasing the temperature rise. An enhancement of heat conduction near the water entrance is ascribed to the temperature gradient and the vortex effect. It can be concluded that the interpolated aluminum sheet with fins presents great potential application due to its simplicity.

KW - MFT

KW - heat dissipation structure

KW - heat flux

KW - hot spot temperature

KW - power loss

UR - https://www.scopus.com/pages/publications/85137352379

U2 - 10.1109/CIEEC54735.2022.9846532

DO - 10.1109/CIEEC54735.2022.9846532

M3 - 会议稿件

AN - SCOPUS:85137352379

T3 - Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022

SP - 2418

EP - 2423

BT - Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 5th IEEE International Electrical and Energy Conference, CIEEC 2022

Y2 - 27 May 2022 through 29 May 2022

ER -

Ma D, Wang W, He J, Li S. Simulation of Interpolated Heat Dissipation Structures Using Fins and Water-cooling for Solid Medium Frequency Transformer. In Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022. Institute of Electrical and Electronics Engineers Inc. 2022. p. 2418-2423. (Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022). doi: 10.1109/CIEEC54735.2022.9846532

Simulation of Interpolated Heat Dissipation Structures Using Fins and Water-cooling for Solid Medium Frequency Transformer

Abstract

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UN SDGs

Keywords

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