Abstract
Thermal effect is inevitable during laser processing and is easy to induce cracks and damage on the hard and brittle materials, especially. The crack generation mechanism during laser ablation of single hole and groups of holes on alumina ceramic has been investigated. A heat conduction model of the nanosecond laser processing of a group of holes has been developed. The temperature field over a AL2O3 sample was modeled and simulated using COMSOL multi-physics. The temperature distribution on the AL2O3 sample was experimentally verified using an infrared thermometer. The present research provides guidance for the high-quality laser machining of group holes over large areas.
| Original language | English |
|---|---|
| Pages (from-to) | 4474-4483 |
| Number of pages | 10 |
| Journal | Ceramics International |
| Volume | 48 |
| Issue number | 4 |
| DOIs | |
| State | Published - 15 Feb 2022 |
Keywords
- ALO
- COMSOL multi-physics
- Group holes
- Nanosecond laser ablation