Shear banding deformation in Cu/Ta nano-multilayers

  • F. Wang
  • , P. Huang
  • , M. Xu
  • , T. J. Lu
  • , K. W. Xu

Research output: Contribution to journalArticlepeer-review

40 Scopus citations

Abstract

Nanoscale Cu/Ta multilayers with individual layer thickness ranging from 3 to 70. nm were deformed under nanoindentation at room temperature. Shear bands can be observed only when individual layer thickness is reduced to 9. nm or below, indicating formation of shear bands in the Cu/Ta multilayers is layer thickness dependent. By observing the cross sectional transmission electron microscope images of the indentation fabricated through focused ion beam technique, shear banding deformation causing a unique layer-morphology with prevalent mismatched laminate structure has been reported for the first time. By capturing and analyzing a series of typical indentation-induced deformed microstructures, a new physical mechanism of shear banding behavior in metallic nano-multilayers is suggested.

Original languageEnglish
Pages (from-to)7290-7294
Number of pages5
JournalMaterials Science and Engineering: A
Volume528
Issue number24
DOIs
StatePublished - 15 Sep 2011

Keywords

  • Grain boundaries
  • Multilayer structure
  • Nanoindentation
  • Shear band

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