TY - GEN
T1 - Semi-Interpenetrating Polymer Blend Exhibit Stable Energy Storage Performance at High Temperatures
AU - Liu, Yongbin
AU - Xu, Yating
AU - Gao, Jinghui
AU - Wu, Ming
AU - Zhong, Lisheng
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - Recently polyvinylidene fluoride (PVDF) based polymers present attractive energy storage performance, however, the inherent pool temperature stability could lead to deteriorated energy storage performance or even thermal runaway, which should be ascribed to vulnerable amorphous regions under elevated temperature. Here we propose a strategy to enhance the temperature stability of polymer blends by interpenetrating high-polarization PVDF-based polymers and high-glass-transition-temperature polymer matrices PMMA. The dielectric properties of the interpenetrating blends are studied and compared with solution blends. When properly engineered, the interpenetrating polymer blends exhibit an appreciated energy density of about 6. 8\sim 7.6{J}/\text{cm}{3} over a wide temperature range from room temperature to 120{\circ}{C}.
AB - Recently polyvinylidene fluoride (PVDF) based polymers present attractive energy storage performance, however, the inherent pool temperature stability could lead to deteriorated energy storage performance or even thermal runaway, which should be ascribed to vulnerable amorphous regions under elevated temperature. Here we propose a strategy to enhance the temperature stability of polymer blends by interpenetrating high-polarization PVDF-based polymers and high-glass-transition-temperature polymer matrices PMMA. The dielectric properties of the interpenetrating blends are studied and compared with solution blends. When properly engineered, the interpenetrating polymer blends exhibit an appreciated energy density of about 6. 8\sim 7.6{J}/\text{cm}{3} over a wide temperature range from room temperature to 120{\circ}{C}.
UR - https://www.scopus.com/pages/publications/85185722556
U2 - 10.1109/CEIDP51414.2023.10410489
DO - 10.1109/CEIDP51414.2023.10410489
M3 - 会议稿件
AN - SCOPUS:85185722556
T3 - Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
BT - 2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2023
Y2 - 15 October 2023 through 19 October 2023
ER -