Selective-filling mold for residual-layer-free patterning of 3D microstructures

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Abstract

We demonstrate a novel selective-filling mold containing physicochemically heterogeneous surfaces to achieve residual-layer-free patterning. Fabricated by femtolaser machining, the mold has hydrophilic surfaces in the concavity and hydrophobic surfaces on the protrusion. The experiments show that, after ink coating, the ink can wet and spread in concavity while dewets and splitted on protrusion, thus isolated ink filaments were finally formed in the concavity and separated by the dry protrusions. Without forming a residual layer, this technique offers an alternative method to fabricate isolated three-dimensional (3D) microstructures. It can be also used for large-area roll-to-roll fabrication of flexible electronics.

Original languageEnglish
Pages (from-to)101-105
Number of pages5
JournalMaterials and Manufacturing Processes
Volume28
Issue number1
DOIs
StatePublished - 2012

Keywords

  • Flexible electronics
  • Microtransfer molding (μTM)
  • Patterning without residual layer
  • Physicochemically heterogeneous surfaces
  • Selective filling

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