Selective Cu patterning on polyimide using UV surface treatment and electroless plating

Sung Won Youn; Kenta Suzuki; Sang Cheon Park; Hideki Takagi; Hiroshi Hiroshima; Ryutaro Maeda

doi:10.2494/photopolymer.28.157

Selective Cu patterning on polyimide using UV surface treatment and electroless plating

Sung Won Youn
, Kenta Suzuki
, Sang Cheon Park
, Hideki Takagi
, Hiroshi Hiroshima
, Ryutaro Maeda

National Institute of Advanced Industrial Science and Technology

Research output: Contribution to journal › Article › peer-review

5 Scopus citations

Abstract

Needs for an inexpensive and simple technology for fabricating fine copper (Cu) patterns on a polyimide (PI) film have been increasing. In this study, vacuum-UV induced surfactant masking (VISM) process was proposed as a tool for simplifying selective electroless Cu plating. The electroless Cu plating process using VISM is capable of Cu patterning on solvent-soluble siloxane-modified polyimide (PI) without photoresist patterning steps unlike conventional electroless Cu plating process. The relation between the wettability of SBC-PI film surface and the UV/Ozone treatment time was investigated to establish VISM process condition. The feasibility of the proposed process was verified by demonstrating the fabrication of Cu/PI patterns with widths ranging from 5 μm to 50 μm and measuring an electric property of some patterns.

Original language	English
Pages (from-to)	157-161
Number of pages	5
Journal	Journal of Photopolymer Science and Technology
Volume	28
Issue number	2
DOIs	https://doi.org/10.2494/photopolymer.28.157
State	Published - 19 Aug 2015
Externally published	Yes

Keywords

Polyimide
Selective electroless copper plating
Surfactant
UV/Ozone treatment

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10.2494/photopolymer.28.157

Cite this

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title = "Selective Cu patterning on polyimide using UV surface treatment and electroless plating",

abstract = "Needs for an inexpensive and simple technology for fabricating fine copper (Cu) patterns on a polyimide (PI) film have been increasing. In this study, vacuum-UV induced surfactant masking (VISM) process was proposed as a tool for simplifying selective electroless Cu plating. The electroless Cu plating process using VISM is capable of Cu patterning on solvent-soluble siloxane-modified polyimide (PI) without photoresist patterning steps unlike conventional electroless Cu plating process. The relation between the wettability of SBC-PI film surface and the UV/Ozone treatment time was investigated to establish VISM process condition. The feasibility of the proposed process was verified by demonstrating the fabrication of Cu/PI patterns with widths ranging from 5 μm to 50 μm and measuring an electric property of some patterns.",

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author = "Youn, \{Sung Won\} and Kenta Suzuki and Park, \{Sang Cheon\} and Hideki Takagi and Hiroshi Hiroshima and Ryutaro Maeda",

note = "Publisher Copyright: {\textcopyright} 2015SPST.",

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doi = "10.2494/photopolymer.28.157",

language = "英语",

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TY - JOUR

T1 - Selective Cu patterning on polyimide using UV surface treatment and electroless plating

AU - Youn, Sung Won

AU - Suzuki, Kenta

AU - Park, Sang Cheon

AU - Takagi, Hideki

AU - Hiroshima, Hiroshi

AU - Maeda, Ryutaro

PY - 2015/8/19

Y1 - 2015/8/19

N2 - Needs for an inexpensive and simple technology for fabricating fine copper (Cu) patterns on a polyimide (PI) film have been increasing. In this study, vacuum-UV induced surfactant masking (VISM) process was proposed as a tool for simplifying selective electroless Cu plating. The electroless Cu plating process using VISM is capable of Cu patterning on solvent-soluble siloxane-modified polyimide (PI) without photoresist patterning steps unlike conventional electroless Cu plating process. The relation between the wettability of SBC-PI film surface and the UV/Ozone treatment time was investigated to establish VISM process condition. The feasibility of the proposed process was verified by demonstrating the fabrication of Cu/PI patterns with widths ranging from 5 μm to 50 μm and measuring an electric property of some patterns.

AB - Needs for an inexpensive and simple technology for fabricating fine copper (Cu) patterns on a polyimide (PI) film have been increasing. In this study, vacuum-UV induced surfactant masking (VISM) process was proposed as a tool for simplifying selective electroless Cu plating. The electroless Cu plating process using VISM is capable of Cu patterning on solvent-soluble siloxane-modified polyimide (PI) without photoresist patterning steps unlike conventional electroless Cu plating process. The relation between the wettability of SBC-PI film surface and the UV/Ozone treatment time was investigated to establish VISM process condition. The feasibility of the proposed process was verified by demonstrating the fabrication of Cu/PI patterns with widths ranging from 5 μm to 50 μm and measuring an electric property of some patterns.

KW - Polyimide

KW - Selective electroless copper plating

KW - Surfactant

KW - UV/Ozone treatment

UR - https://www.scopus.com/pages/publications/84939537285

U2 - 10.2494/photopolymer.28.157

DO - 10.2494/photopolymer.28.157

M3 - 文章

AN - SCOPUS:84939537285

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JO - Journal of Photopolymer Science and Technology

JF - Journal of Photopolymer Science and Technology

IS - 2

ER -

Selective Cu patterning on polyimide using UV surface treatment and electroless plating

Abstract

Keywords

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