Role of Micro-nano Hexagonal Boron Nitride Coordination on Thermal Conductivity and Breakdown Strength of Epoxy Composites

  • Zhuolin Cheng
  • , Jiao Xiang
  • , Chuang Zhang
  • , Hang Fu
  • , Lei Xin
  • , Xiaotong Zhang
  • , Shihang Wang
  • , Jianying Li

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Epoxy resin (EP) has been used as insulating material in power electronic transformer (PET), while low thermal conductivity of EP limits the heat dissipation efficiency of PET. Role of Micro-nano hexagonal boron nitride coordination on thermal conductivity and breakdown strength of epoxy composites was explored. A thermal conductivity of 0.544 W/(m·K) was obtained for 10 wt% BN/EP micro composites, increased by 149.5% compared with pristine epoxy. In addition, the specimen with a dual doping of 10 wt% h-BN and 5 wt% nano filler exhibited both improved thermal conductivity of 0.527 W/(m·K) and breakdown strength of 118.3 kV/mm. It is found that micro-BN could effectively increase the thermal conductivity since efficient heat transform path would be built inside epoxy matrix. Meanwhile, nano-BN would bring in independent interfacial regions that capture carriers at low filler content. Based on the coordination of micro-nano particles, the thermal conductivity and breakdown strength can thus be enhanced simultaneously.

Original languageEnglish
Title of host publication7th IEEE International Conference on High Voltage Engineering and Application, ICHVE 2020 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728155111
DOIs
StatePublished - 6 Sep 2020
Event7th IEEE International Conference on High Voltage Engineering and Application, ICHVE 2020 - Beijing, China
Duration: 6 Sep 202010 Sep 2020

Publication series

Name7th IEEE International Conference on High Voltage Engineering and Application, ICHVE 2020 - Proceedings

Conference

Conference7th IEEE International Conference on High Voltage Engineering and Application, ICHVE 2020
Country/TerritoryChina
CityBeijing
Period6/09/2010/09/20

Keywords

  • boron nitride
  • dielectric properties
  • epoxy
  • power electronic transformer
  • thermal conductivity

Fingerprint

Dive into the research topics of 'Role of Micro-nano Hexagonal Boron Nitride Coordination on Thermal Conductivity and Breakdown Strength of Epoxy Composites'. Together they form a unique fingerprint.

Cite this