Rheological behavior of multi-sized SiC inks containing polyelectrolyte complexes specifically for direct ink writing

Sai Li; Zhongliang Lu; Haitian Zhang; Zichao Ai; Yang Ran; Yanzhen Li; Xin Deng; Dichen Li

doi:10.1016/j.jeurceramsoc.2022.04.048

Rheological behavior of multi-sized SiC inks containing polyelectrolyte complexes specifically for direct ink writing

Sai Li
, Zhongliang Lu
, Haitian Zhang
, Zichao Ai
, Yang Ran
, Yanzhen Li
, Xin Deng
, Dichen Li

School of Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

16 Scopus citations

Abstract

In order to simultaneously improve both the solid loading and rheological behavior of ceramic ink during direct ink writing (DIW) process, the polyelectrolyte complexes have been used as rheological modifiers. Based on the Funk-Dinger function, the maximum solid loading of multi-sized SiC ink reached 63 vol%. The viscoelasticity of SiC inks with different [COOH]:[NH_x] molar ratios was investigated and the mechanism of polyionic chains on rheology was analyzed. When the [COOH]:[NH_x] molar ratio was 1:0.1, the SiC ink exhibited excellent thixotropic behavior and formability. The effect of particle size on rheological behavior of SiC ink was investigated to clarify the correlation between polyelectrolyte complexes and multi-sized SiC.

Original language	English
Pages (from-to)	4810-4816
Number of pages	7
Journal	Journal of the European Ceramic Society
Volume	42
Issue number	12
DOIs	https://doi.org/10.1016/j.jeurceramsoc.2022.04.048
State	Published - Sep 2022

Keywords

Direct ink writing
Polyelectrolyte complexes
Rheological behavior
Silicon carbide
Solid loading

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10.1016/j.jeurceramsoc.2022.04.048

Cite this

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title = "Rheological behavior of multi-sized SiC inks containing polyelectrolyte complexes specifically for direct ink writing",

abstract = "In order to simultaneously improve both the solid loading and rheological behavior of ceramic ink during direct ink writing (DIW) process, the polyelectrolyte complexes have been used as rheological modifiers. Based on the Funk-Dinger function, the maximum solid loading of multi-sized SiC ink reached 63 vol\%. The viscoelasticity of SiC inks with different [COOH]:[NHx] molar ratios was investigated and the mechanism of polyionic chains on rheology was analyzed. When the [COOH]:[NHx] molar ratio was 1:0.1, the SiC ink exhibited excellent thixotropic behavior and formability. The effect of particle size on rheological behavior of SiC ink was investigated to clarify the correlation between polyelectrolyte complexes and multi-sized SiC.",

keywords = "Direct ink writing, Polyelectrolyte complexes, Rheological behavior, Silicon carbide, Solid loading",

author = "Sai Li and Zhongliang Lu and Haitian Zhang and Zichao Ai and Yang Ran and Yanzhen Li and Xin Deng and Dichen Li",

note = "Publisher Copyright: {\textcopyright} 2022 Elsevier Ltd",

year = "2022",

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doi = "10.1016/j.jeurceramsoc.2022.04.048",

language = "英语",

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TY - JOUR

T1 - Rheological behavior of multi-sized SiC inks containing polyelectrolyte complexes specifically for direct ink writing

AU - Li, Sai

AU - Lu, Zhongliang

AU - Zhang, Haitian

AU - Ai, Zichao

AU - Ran, Yang

AU - Li, Yanzhen

AU - Deng, Xin

AU - Li, Dichen

PY - 2022/9

Y1 - 2022/9

N2 - In order to simultaneously improve both the solid loading and rheological behavior of ceramic ink during direct ink writing (DIW) process, the polyelectrolyte complexes have been used as rheological modifiers. Based on the Funk-Dinger function, the maximum solid loading of multi-sized SiC ink reached 63 vol%. The viscoelasticity of SiC inks with different [COOH]:[NHx] molar ratios was investigated and the mechanism of polyionic chains on rheology was analyzed. When the [COOH]:[NHx] molar ratio was 1:0.1, the SiC ink exhibited excellent thixotropic behavior and formability. The effect of particle size on rheological behavior of SiC ink was investigated to clarify the correlation between polyelectrolyte complexes and multi-sized SiC.

AB - In order to simultaneously improve both the solid loading and rheological behavior of ceramic ink during direct ink writing (DIW) process, the polyelectrolyte complexes have been used as rheological modifiers. Based on the Funk-Dinger function, the maximum solid loading of multi-sized SiC ink reached 63 vol%. The viscoelasticity of SiC inks with different [COOH]:[NHx] molar ratios was investigated and the mechanism of polyionic chains on rheology was analyzed. When the [COOH]:[NHx] molar ratio was 1:0.1, the SiC ink exhibited excellent thixotropic behavior and formability. The effect of particle size on rheological behavior of SiC ink was investigated to clarify the correlation between polyelectrolyte complexes and multi-sized SiC.

KW - Direct ink writing

KW - Polyelectrolyte complexes

KW - Rheological behavior

KW - Silicon carbide

KW - Solid loading

UR - https://www.scopus.com/pages/publications/85130344688

U2 - 10.1016/j.jeurceramsoc.2022.04.048

DO - 10.1016/j.jeurceramsoc.2022.04.048

M3 - 文章

AN - SCOPUS:85130344688

SN - 0955-2219

VL - 42

SP - 4810

EP - 4816

JO - Journal of the European Ceramic Society

JF - Journal of the European Ceramic Society

IS - 12

ER -

Rheological behavior of multi-sized SiC inks containing polyelectrolyte complexes specifically for direct ink writing

Abstract

Keywords

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