Pressure contact structure and electrical contact propoerty of integrated power electronic module

This paper presents a novel pressure contact interconnect technique in integrated power electronic module (IPEM) with high reliability. The central component of this technique is a break spring made of BeCu alloy. The break spring not only provides enough press-contact force, but also implements electrical interconnection. The technique exhibits excellent ability of withstanding thermal stress, and is also manufactured with a very simple process. Contact resistance of the pressure contact structure is investigated. A half-bridge IPEM based on pressure contact technique is proposed. Thermal cycling and power experiments were carried out, and the break spring pressure contact technique is verified to be feasible.