Abstract
An ultra-low nitrogen atmosphere strategy of magnetron sputtering deposition with dynamic regulation of sputtering atmosphere was developed to prepare gradient α-Ta(N)/TaN bi-layer films, which have lower resistivity and high thermal stabilization. This deposition method can avoid effectively the high resistivity of bi-layer barrier films resulted from the N integration and the introduction of heterogeneous elements for the transformation of α-Ta phase. X-ray diffraction spectra (XRD), Four-point probe (FPP) measurement and Transmission electron microscopy (TEM) were used for characterization of the film microstructure. The results show that the as-deposited gradient α-Ta(N)/TaN bi-layer films have lower resistivity and good crystallinity, and the gradient α-Ta(N)/TaN bi-layer films have good structure stability even annealed at 600°C for 60 min in vacuum.
| Original language | English |
|---|---|
| Pages (from-to) | 1855-1858 |
| Number of pages | 4 |
| Journal | Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering |
| Volume | 41 |
| Issue number | 10 |
| State | Published - Oct 2012 |
Keywords
- Diffusion barrier
- Microstructure
- Resistivity
- Thermal stability
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