Picosecond laser ablation of thin copper films

J. Jandeleit; G. Urbasch; H. D. Hoffmann; H. G. Treusch; E. W. Kreutz

doi:10.1007/BF01567638

Picosecond laser ablation of thin copper films

J. Jandeleit
, G. Urbasch
, H. D. Hoffmann
, H. G. Treusch
, E. W. Kreutz

RWTH Aachen University
Fraunhofer Institute for Laser Technology

Research output: Contribution to journal › Article › peer-review

174 Scopus citations

Abstract

The ablation process of thin copper films on fused silica by picosecond laser pulses is investigated. The ablation area is characterized using optical and scanning electron microscopy. The single-shot ablation threshold fluence for 40 ps laser pulses at 1053 nm has been determinated to F_thres = 172 mJ/cm². The ablation rate per pulse is measured as a function of intensity in the range of 5 × 10⁹ to 2 × 10¹¹ W/cm² and changes from 80 to 250 nm with increasing intensity. The experimental ablation rate per pulse is compared to heat-flow calculations based on the two-temperature model for ultrafast laser heating. Possible applications of picosecond laser radiation for microstructuring of different materials are discussed.

Original language	English
Pages (from-to)	117-121
Number of pages	5
Journal	Applied Physics A: Materials Science and Processing
Volume	63
Issue number	2
DOIs	https://doi.org/10.1007/BF01567638
State	Published - Aug 1996
Externally published	Yes

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title = "Picosecond laser ablation of thin copper films",

abstract = "The ablation process of thin copper films on fused silica by picosecond laser pulses is investigated. The ablation area is characterized using optical and scanning electron microscopy. The single-shot ablation threshold fluence for 40 ps laser pulses at 1053 nm has been determinated to Fthres = 172 mJ/cm2. The ablation rate per pulse is measured as a function of intensity in the range of 5 {\texttimes} 109 to 2 {\texttimes} 1011 W/cm2 and changes from 80 to 250 nm with increasing intensity. The experimental ablation rate per pulse is compared to heat-flow calculations based on the two-temperature model for ultrafast laser heating. Possible applications of picosecond laser radiation for microstructuring of different materials are discussed.",

author = "J. Jandeleit and G. Urbasch and Hoffmann, \{H. D.\} and Treusch, \{H. G.\} and Kreutz, \{E. W.\}",

year = "1996",

month = aug,

doi = "10.1007/BF01567638",

language = "英语",

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pages = "117--121",

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issn = "0947-8396",

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T1 - Picosecond laser ablation of thin copper films

AU - Jandeleit, J.

AU - Urbasch, G.

AU - Hoffmann, H. D.

AU - Treusch, H. G.

AU - Kreutz, E. W.

PY - 1996/8

Y1 - 1996/8

N2 - The ablation process of thin copper films on fused silica by picosecond laser pulses is investigated. The ablation area is characterized using optical and scanning electron microscopy. The single-shot ablation threshold fluence for 40 ps laser pulses at 1053 nm has been determinated to Fthres = 172 mJ/cm2. The ablation rate per pulse is measured as a function of intensity in the range of 5 × 109 to 2 × 1011 W/cm2 and changes from 80 to 250 nm with increasing intensity. The experimental ablation rate per pulse is compared to heat-flow calculations based on the two-temperature model for ultrafast laser heating. Possible applications of picosecond laser radiation for microstructuring of different materials are discussed.

AB - The ablation process of thin copper films on fused silica by picosecond laser pulses is investigated. The ablation area is characterized using optical and scanning electron microscopy. The single-shot ablation threshold fluence for 40 ps laser pulses at 1053 nm has been determinated to Fthres = 172 mJ/cm2. The ablation rate per pulse is measured as a function of intensity in the range of 5 × 109 to 2 × 1011 W/cm2 and changes from 80 to 250 nm with increasing intensity. The experimental ablation rate per pulse is compared to heat-flow calculations based on the two-temperature model for ultrafast laser heating. Possible applications of picosecond laser radiation for microstructuring of different materials are discussed.

UR - https://www.scopus.com/pages/publications/0030213995

U2 - 10.1007/BF01567638

DO - 10.1007/BF01567638

M3 - 文章

AN - SCOPUS:0030213995

SN - 0947-8396

VL - 63

SP - 117

EP - 121

JO - Applied Physics A: Materials Science and Processing

JF - Applied Physics A: Materials Science and Processing

IS - 2

ER -

Picosecond laser ablation of thin copper films

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