@inproceedings{b566a8d35873450fb4f8f80a382d1572,
title = "Phase composition, microstructure and thermal diffusivity of Cu/Si composites sintering temperature dependence",
abstract = "Cu/Si composites may become novel high-performance electronic packaging materials owing to combining the advantages of copper and silicon components. Here, we prepared Cu/Si composites by being sintered below and above eutectic temperature 802 °C, respectively, and found that sintering temperature notably affects their composition, microstructure and thermal diffusivity. The composites sintered at 780 °C are composed of copper and silicon, exhibiting dispersed silicon particles and continuous copper matrix, but those sintered at 820 °C primarily contain Cu3Si compounds, and a porous microstructure is observed. The thermal diffusivity of the former is over 21 times higher than that of the latter.",
keywords = "Cu/Si composites, Microstructure, Phase, Sintering temperature, Thermal diffusivity",
author = "Hui Cai and Yaping Wang and Xiaoping Song and Bingjun Ding",
year = "2011",
doi = "10.4028/www.scientific.net/AMR.275.200",
language = "英语",
isbn = "9783037851760",
series = "Advanced Materials Research",
pages = "200--203",
booktitle = "Structural Integrity and Failure, SIF 2010",
note = "International Conference on Structural Integrity and Failure, SIF2010 ; Conference date: 04-07-2010 Through 07-07-2010",
}