TY - GEN
T1 - On-chip phase change optical matrix multiplication core
AU - Li, Xuan
AU - Youngblood, Nathan
AU - Zhou, Wen
AU - Feldmann, Johannes
AU - Swett, Jacob
AU - Aggarwal, Samarth
AU - Sebastian, A.
AU - Wright, C. David
AU - Pernice, Wolfram
AU - Bhaskaran, Harish
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/12/12
Y1 - 2020/12/12
N2 - We demonstrated a non-volatile photonic matrix computation core which contains a 3×3 photonic phase change in-memory computing matrix to carry out matrix vector multiplication on a silicon-based substrate. We established an optical computing core model and hardware implementation based on our photonic phase change material (PCM) devices and fabricated a 3×3 matrix using the silicon photonic foundry. We demonstrated the functionality of this matrix as the linear convolution layer in a convolutional neural network (CNN) and demonstrated simple pattern recognition. Finally, we simulated scaling up matrix limits using experimental data from smaller matrices. This on-chip, non-volatile, photonic computation matrix transfers optical computing from single device to matrix, paving the way for practical wide usage of optical computing systems.
AB - We demonstrated a non-volatile photonic matrix computation core which contains a 3×3 photonic phase change in-memory computing matrix to carry out matrix vector multiplication on a silicon-based substrate. We established an optical computing core model and hardware implementation based on our photonic phase change material (PCM) devices and fabricated a 3×3 matrix using the silicon photonic foundry. We demonstrated the functionality of this matrix as the linear convolution layer in a convolutional neural network (CNN) and demonstrated simple pattern recognition. Finally, we simulated scaling up matrix limits using experimental data from smaller matrices. This on-chip, non-volatile, photonic computation matrix transfers optical computing from single device to matrix, paving the way for practical wide usage of optical computing systems.
UR - https://www.scopus.com/pages/publications/85102922488
U2 - 10.1109/IEDM13553.2020.9372052
DO - 10.1109/IEDM13553.2020.9372052
M3 - 会议稿件
AN - SCOPUS:85102922488
T3 - Technical Digest - International Electron Devices Meeting, IEDM
SP - 7.5.1-7.5.4
BT - 2020 IEEE International Electron Devices Meeting, IEDM 2020
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 66th Annual IEEE International Electron Devices Meeting, IEDM 2020
Y2 - 12 December 2020 through 18 December 2020
ER -