TY - JOUR
T1 - Numerical simulation of non-Fourier heat conduction in fins by lattice Boltzmann method
AU - Liu, Yi
AU - Li, Ling
AU - Zhang, Yuwen
N1 - Publisher Copyright:
© 2019 Elsevier Ltd
PY - 2020/2/5
Y1 - 2020/2/5
N2 - The addition of fin to the surface of microelectronic elements is a very effective way to enhance their heat transfer rate. Since the heat generation of the microelectronic elements is very fast, the Fourier law is no longer valid and the non-Fourier effect must be considered when designing a fin. Cattaneo – Vernotte model (CV model) is the most common model that is used to describe the non-Fourier effect in heat conduction. The mathematical expression of the CV model is essentially a wave equation. The lattice Boltzmann method (LBM) can be used to solve the wave equation in the CV heat conduction problem. In this paper, LBM is used to solve the non-Fourier heat conduction in a fin under periodic boundary conditions. Effects of relaxation time, shape and the frequency of the base temperature oscillations on heat transfer efficiency are analyzed.
AB - The addition of fin to the surface of microelectronic elements is a very effective way to enhance their heat transfer rate. Since the heat generation of the microelectronic elements is very fast, the Fourier law is no longer valid and the non-Fourier effect must be considered when designing a fin. Cattaneo – Vernotte model (CV model) is the most common model that is used to describe the non-Fourier effect in heat conduction. The mathematical expression of the CV model is essentially a wave equation. The lattice Boltzmann method (LBM) can be used to solve the wave equation in the CV heat conduction problem. In this paper, LBM is used to solve the non-Fourier heat conduction in a fin under periodic boundary conditions. Effects of relaxation time, shape and the frequency of the base temperature oscillations on heat transfer efficiency are analyzed.
KW - Heat transfer and efficiency of fin
KW - Lattice Boltzmann method
KW - Non-Fourier heat conduction
UR - https://www.scopus.com/pages/publications/85075830115
U2 - 10.1016/j.applthermaleng.2019.114670
DO - 10.1016/j.applthermaleng.2019.114670
M3 - 文章
AN - SCOPUS:85075830115
SN - 1359-4311
VL - 166
JO - Applied Thermal Engineering
JF - Applied Thermal Engineering
M1 - 114670
ER -