TY - GEN
T1 - Novel nanocomposite thin film for arc ablation resistance
AU - Davis, Kerry
AU - Wang, Yifei
AU - Wang, Qian
AU - Cao, Yang
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021
Y1 - 2021
N2 - High Voltage Direct Current (HVDC) transmission systems are at the forefront of electrical engineering research. There are a few challenges with incorporating HVDC for industrial use, of which, developing safe and capable circuit breakers is of utmost importance. When a circuit breaks in a HVDC system, arc plasma is generated due to the extremely high voltages. This work presents a unique solution for arc ablation resistant materials, a thin Poly(methyl methacrylate) (PMMA) film with inorganic fillers dip-coated on an alumina substrate. The presence of Zinc Oxide nanofillers increases the dielectric permittivity while keeping the loss tangent the same as the baseline PMMA coating. The presence of Zinc Oxide is also shown to shift the UV absorption peak, indicating that the composite can be tuned for energy absorption during plasma arc.
AB - High Voltage Direct Current (HVDC) transmission systems are at the forefront of electrical engineering research. There are a few challenges with incorporating HVDC for industrial use, of which, developing safe and capable circuit breakers is of utmost importance. When a circuit breaks in a HVDC system, arc plasma is generated due to the extremely high voltages. This work presents a unique solution for arc ablation resistant materials, a thin Poly(methyl methacrylate) (PMMA) film with inorganic fillers dip-coated on an alumina substrate. The presence of Zinc Oxide nanofillers increases the dielectric permittivity while keeping the loss tangent the same as the baseline PMMA coating. The presence of Zinc Oxide is also shown to shift the UV absorption peak, indicating that the composite can be tuned for energy absorption during plasma arc.
UR - https://www.scopus.com/pages/publications/85126031559
U2 - 10.1109/CEIDP50766.2021.9705445
DO - 10.1109/CEIDP50766.2021.9705445
M3 - 会议稿件
AN - SCOPUS:85126031559
T3 - Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
SP - 352
EP - 354
BT - 96th IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2021 - co-located with 16th IEEE Nanotechnology Materials and Devices Conference, NMDC 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 96th IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2021
Y2 - 12 December 2021 through 15 December 2021
ER -