New wafer-scale MEMS fabrication of 3D silicon/metal cantilever array sensor

Y. Zhang; A. Toda; H. Okada; T. Kobayashi; T. Itoh; R. Maeda

doi:10.1109/MEMSYS.2012.6170153

New wafer-scale MEMS fabrication of 3D silicon/metal cantilever array sensor

Y. Zhang
, A. Toda
, H. Okada
, T. Kobayashi
, T. Itoh
, R. Maeda

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

5 Scopus citations

Abstract

This paper presents a new wafer-scale micromachining technology of three-dimensional (3D) cantilever array for sensor application. The 3D cantilever consists of a vertically Si/metal laminated structure and works in the in-the-plane mode so that it has the advantage of easy-to-package, non-stiction and compact. Prototype of 5-pair 3D cantilever array was successfully fabricated in 4-inch wafer scale. However, its fabrication is involved of micromachining technology of metal film on high aspect ratio structures. 4-inch wafer-scale wet-etching technology of electroless-plated Ni-8%P alloy film (∼1.5 μm-thick) was for the first time successfully established on a high topographic surface with the minimum feature size of about 20 μm.

Original language	English
Title of host publication	2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012
Pages	297-300
Number of pages	4
DOIs	https://doi.org/10.1109/MEMSYS.2012.6170153
State	Published - 2012
Externally published	Yes
Event	2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012 - Paris, France Duration: 29 Jan 2012 → 2 Feb 2012

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)	1084-6999

Conference

Conference	2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012
Country/Territory	France
City	Paris
Period	29/01/12 → 2/02/12

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10.1109/MEMSYS.2012.6170153

Cite this

Zhang, Y., Toda, A., Okada, H., Kobayashi, T., Itoh, T., & Maeda, R. (2012). New wafer-scale MEMS fabrication of 3D silicon/metal cantilever array sensor. In 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012 (pp. 297-300). Article 6170153 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2012.6170153

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title = "New wafer-scale MEMS fabrication of 3D silicon/metal cantilever array sensor",

abstract = "This paper presents a new wafer-scale micromachining technology of three-dimensional (3D) cantilever array for sensor application. The 3D cantilever consists of a vertically Si/metal laminated structure and works in the in-the-plane mode so that it has the advantage of easy-to-package, non-stiction and compact. Prototype of 5-pair 3D cantilever array was successfully fabricated in 4-inch wafer scale. However, its fabrication is involved of micromachining technology of metal film on high aspect ratio structures. 4-inch wafer-scale wet-etching technology of electroless-plated Ni-8\%P alloy film (∼1.5 μm-thick) was for the first time successfully established on a high topographic surface with the minimum feature size of about 20 μm.",

author = "Y. Zhang and A. Toda and H. Okada and T. Kobayashi and T. Itoh and R. Maeda",

year = "2012",

doi = "10.1109/MEMSYS.2012.6170153",

language = "英语",

isbn = "9781467303248",

series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

pages = "297--300",

booktitle = "2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012",

note = "2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012 ; Conference date: 29-01-2012 Through 02-02-2012",

}

Zhang, Y, Toda, A, Okada, H, Kobayashi, T, Itoh, T & Maeda, R 2012, New wafer-scale MEMS fabrication of 3D silicon/metal cantilever array sensor. in 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012., 6170153, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), pp. 297-300, 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012, Paris, France, 29/01/12. https://doi.org/10.1109/MEMSYS.2012.6170153

New wafer-scale MEMS fabrication of 3D silicon/metal cantilever array sensor. / Zhang, Y.; Toda, A.; Okada, H. et al.
2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012. 2012. p. 297-300 6170153 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Itoh, T.

AU - Maeda, R.

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AB - This paper presents a new wafer-scale micromachining technology of three-dimensional (3D) cantilever array for sensor application. The 3D cantilever consists of a vertically Si/metal laminated structure and works in the in-the-plane mode so that it has the advantage of easy-to-package, non-stiction and compact. Prototype of 5-pair 3D cantilever array was successfully fabricated in 4-inch wafer scale. However, its fabrication is involved of micromachining technology of metal film on high aspect ratio structures. 4-inch wafer-scale wet-etching technology of electroless-plated Ni-8%P alloy film (∼1.5 μm-thick) was for the first time successfully established on a high topographic surface with the minimum feature size of about 20 μm.

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Zhang Y, Toda A, Okada H, Kobayashi T, Itoh T, Maeda R. New wafer-scale MEMS fabrication of 3D silicon/metal cantilever array sensor. In 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012. 2012. p. 297-300. 6170153. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). doi: 10.1109/MEMSYS.2012.6170153

New wafer-scale MEMS fabrication of 3D silicon/metal cantilever array sensor

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