Molecular dynamics simulation of liquid interface and cooling process near the solid wall

Three-phase model study of MD shows a laminated liquid density distribution and oscillating distribution of tangential stress in the near-wall region. The solid-liquid interface tension reduces with increasing temperature and wall wettability does not have significant influence on the interface tension. Wall of the same temperature impacts on liquid characteristics near wall, and outside wall neighboring region liquid-vapor interface characteristics are consistent with result of classical two phase model. The cooling process simulation indicates that heat transfer decreases with decreasing temperature difference, and the contact thermal resistance is predominant.