TY - JOUR
T1 - Mold deformation in soft UV-nanoimprint lithography
AU - Lan, Hongbo
AU - Ding, Yucheng
AU - Liu, Hongzhong
AU - Que, Yerong
AU - Tao, Weiwei
AU - Li, Hansong
AU - Lu, Bingheng
PY - 2009/2
Y1 - 2009/2
N2 - UV-nanoimprint lithography (UV-NIL) using a soft mold is a promising technique with low cost and high throughput for producing the submicron scale large-area patterns. However, the deformations of the soft mold during imprinting process which can cause serious consequences have to be understood for the practical application of the process. This paper investigated the deformation of the soft mold by theoretical analyses, numerical simulations, and experimental studies. We simulated the mold deformation using a simplified model and finite element method. The simulation and the related experimental results agree well with each other. Through the investigation, the mechanism and affected factors of the mold deformation are revealed, and some useful conclusions have been achieved. These results will be valuable in optimizing the imprinting process conditions and mold design for improving the quality of transferred patterns.
AB - UV-nanoimprint lithography (UV-NIL) using a soft mold is a promising technique with low cost and high throughput for producing the submicron scale large-area patterns. However, the deformations of the soft mold during imprinting process which can cause serious consequences have to be understood for the practical application of the process. This paper investigated the deformation of the soft mold by theoretical analyses, numerical simulations, and experimental studies. We simulated the mold deformation using a simplified model and finite element method. The simulation and the related experimental results agree well with each other. Through the investigation, the mechanism and affected factors of the mold deformation are revealed, and some useful conclusions have been achieved. These results will be valuable in optimizing the imprinting process conditions and mold design for improving the quality of transferred patterns.
KW - Deformation
KW - Finite element model
KW - Numerical simulation
KW - Soft mold
KW - UV-nanoimprint lithography (UV-NIL)
UR - https://www.scopus.com/pages/publications/59849089611
U2 - 10.1007/s11431-008-0199-1
DO - 10.1007/s11431-008-0199-1
M3 - 文章
AN - SCOPUS:59849089611
SN - 1006-9321
VL - 52
SP - 294
EP - 302
JO - Science in China, Series E: Technological Sciences
JF - Science in China, Series E: Technological Sciences
IS - 2
ER -