@inproceedings{af7055a2b234453683dd3e4459440f79,
title = "Modeling of rapid planar solidification of a binary alloy",
abstract = "Many manufacturing systems involving fast-moving substrates or material to be processed are intended to achieve conditions that would result in rapid solidification with undercooling. A general one-dimensional model for planar solidification of binary alloys under non-equilibrium solidification and melt undercooling conditions has been developed to investigate these processes. Solidification kinetics relationships for binary alloys are introduced to supplement the heat and solute diffusion equations in order to provide a more complete description of this moving boundary problem. We use an implicit finite difference method with solid/liquid interface immobilization by coordinate transformation. An efficient iteration scheme was developed to calculate the varying temperature and solute concentrations at the moving solid/liquid interface. As an example, splat cooling of a dilute binary nickel alloy is analyzed and some typical results are presented.",
author = "Wang, \{G. X.\} and Matthys, \{E. F.\}",
year = "1993",
language = "英语",
isbn = "0791810070",
series = "American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD",
publisher = "Publ by ASME",
pages = "35--44",
editor = "J.H. Kim",
booktitle = "Heat and Mass Transfers in Materials Processing and Manufacturing",
note = "Proceedings of the 1993 ASME Winter Annual Meeting ; Conference date: 28-11-1993 Through 03-12-1993",
}