Modeling and Defect Analysis of Transformer-Less Multilevel Back-to-Back Cascaded H-Bridge Converter

  • Zhenhong Lai
  • , Kexu Zhao
  • , Hao Yi
  • , Zhenxiong Wang
  • , Fang Zhuo
  • , Haoyan Zhuang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Back-to-back (B2B) soft open point (SOP) is a widely adopted solution for connecting distribution networks with different phases. In medium voltage networks, two commonly used topologies are modular multilevel converters (MMC) and cascaded H-bridge converters (CHB). However, these schemes require a large number of semiconductor devices, which hinders the widespread adoption of B2B-type SOP in medium voltage networks. In this paper, the scheme of the addition of inductance to the transformer-less B2B-CHB topology to mitigate the short-circuit current is proposed. This modification shows promise in reducing the cost and size of the medium voltage B2B-type SOP. A single-phase model is established and the control system is designed to ensure stable operation. Using the mathematical model of the system, certain drawbacks of the transformer-less B2B-CHB topology are identified. Specifically, the output current range of the converters is significantly influenced by the grid voltage of both sides, and there is a sharp variation in the current distribution among the semiconductors. The theoretical reasons are analyzed for these phenomena and verified through simulations.

Original languageEnglish
Title of host publicationPEAS 2023 - 2023 IEEE 2nd International Power Electronics and Application Symposium, Conference Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages2198-2202
Number of pages5
ISBN (Electronic)9798350313765
DOIs
StatePublished - 2023
Event2nd IEEE International Power Electronics and Application Symposium, PEAS 2023 - Guangzhou, China
Duration: 10 Nov 202313 Nov 2023

Publication series

NamePEAS 2023 - 2023 IEEE 2nd International Power Electronics and Application Symposium, Conference Proceedings

Conference

Conference2nd IEEE International Power Electronics and Application Symposium, PEAS 2023
Country/TerritoryChina
CityGuangzhou
Period10/11/2313/11/23

Keywords

  • Transformer-less
  • back-to-back
  • mathematical model
  • multilevel cascaded H-bridge converter
  • soft open point

Fingerprint

Dive into the research topics of 'Modeling and Defect Analysis of Transformer-Less Multilevel Back-to-Back Cascaded H-Bridge Converter'. Together they form a unique fingerprint.

Cite this