Modal analyses of the acoustic-vibration sensors shock isolating packaging models

  • Jing Hua Yin
  • , Guang Jun Lu
  • , Bing Du
  • , Feng Ren
  • , Xiao Wei Liu
  • , Qing Quan Lei

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

Abstract

The shock isolating principle has been used to design two packaging models of the acoustic sensor in the acoustic-vibration sensors system. The first model is the traditional type of the shock isolating packaging, and the second model is double J-like shock isolating packaging. The relationship curves between the frequencies of the two models and their scale parameters have been gained through modal analyses by use of the finite element analysis software Ansys. The results show that the natural frequencies of the double J-like model are less than those of the traditional model, when the scale parameters of the double J-like model are: R = 1.6 mm, r = 1.2 mm and H = 8 mm, and its three natural frequencies have been given, f1 = 30.90 Hz, f2 = 105.99 Hz, f3 = 130.84 Hz.

Original languageEnglish
Pages (from-to)983-985
Number of pages3
JournalHarbin Gongye Daxue Xuebao/Journal of Harbin Institute of Technology
Volume37
Issue number7
StatePublished - Jul 2005
Externally publishedYes

Keywords

  • Acoustic-vibration sensors system
  • Modal analysis
  • Packaging
  • Shock isolating

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