Microstructuring of dual damascene opening by using hot-embossing combined with etch-back process

Sung Won Youn; Akihisa Ueno; Masaharu Takahashi; Ryutaro Maeda

doi:10.1109/IMNC.2007.4456230

Microstructuring of dual damascene opening by using hot-embossing combined with etch-back process

Sung Won Youn
, Akihisa Ueno
, Masaharu Takahashi
, Ryutaro Maeda

National Institute of Advanced Industrial Science and Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

We demonstrate a structuring process of a dual damascene opening in parylene-C/Si sample by using hot-embossing combined with etch-back technique. By lowering the initial layer thickness, the residual layer thickness could be reduced to a negligibly low level, coming along with a very good uniformity. After the subsequent O₂/CHF₃-based RIE, a dual damascene opening was successfully formed in parylene-C/Si sample.

Original language	English
Title of host publication	Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC
Pages	314-315
Number of pages	2
DOIs	https://doi.org/10.1109/IMNC.2007.4456230
State	Published - 2007
Externally published	Yes
Event	s20th International Microprocesses and Nanotechnology Conference, MNC 2007 - Kyoto, Japan Duration: 5 Nov 2007 → 8 Nov 2007

Publication series

Name	Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC

Conference

Conference	s20th International Microprocesses and Nanotechnology Conference, MNC 2007
Country/Territory	Japan
City	Kyoto
Period	5/11/07 → 8/11/07

Access to Document

10.1109/IMNC.2007.4456230

Cite this

Youn, S. W., Ueno, A., Takahashi, M., & Maeda, R. (2007). Microstructuring of dual damascene opening by using hot-embossing combined with etch-back process. In Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC (pp. 314-315). Article 4456230 (Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC). https://doi.org/10.1109/IMNC.2007.4456230

Youn, Sung Won ; Ueno, Akihisa ; Takahashi, Masaharu et al. / Microstructuring of dual damascene opening by using hot-embossing combined with etch-back process. Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC. 2007. pp. 314-315 (Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC).

@inproceedings{f61d744e5b4f4ad6b04c9b8690d4518f,

title = "Microstructuring of dual damascene opening by using hot-embossing combined with etch-back process",

abstract = "We demonstrate a structuring process of a dual damascene opening in parylene-C/Si sample by using hot-embossing combined with etch-back technique. By lowering the initial layer thickness, the residual layer thickness could be reduced to a negligibly low level, coming along with a very good uniformity. After the subsequent O2/CHF3-based RIE, a dual damascene opening was successfully formed in parylene-C/Si sample.",

author = "Youn, \{Sung Won\} and Akihisa Ueno and Masaharu Takahashi and Ryutaro Maeda",

year = "2007",

doi = "10.1109/IMNC.2007.4456230",

language = "英语",

isbn = "4990247248",

series = "Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC",

pages = "314--315",

booktitle = "Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC",

note = "s20th International Microprocesses and Nanotechnology Conference, MNC 2007 ; Conference date: 05-11-2007 Through 08-11-2007",

}

Youn, SW, Ueno, A, Takahashi, M & Maeda, R 2007, Microstructuring of dual damascene opening by using hot-embossing combined with etch-back process. in Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC., 4456230, Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC, pp. 314-315, s20th International Microprocesses and Nanotechnology Conference, MNC 2007, Kyoto, Japan, 5/11/07. https://doi.org/10.1109/IMNC.2007.4456230

Microstructuring of dual damascene opening by using hot-embossing combined with etch-back process. / Youn, Sung Won; Ueno, Akihisa; Takahashi, Masaharu et al.
Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC. 2007. p. 314-315 4456230 (Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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T1 - Microstructuring of dual damascene opening by using hot-embossing combined with etch-back process

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AU - Takahashi, Masaharu

AU - Maeda, Ryutaro

PY - 2007

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N2 - We demonstrate a structuring process of a dual damascene opening in parylene-C/Si sample by using hot-embossing combined with etch-back technique. By lowering the initial layer thickness, the residual layer thickness could be reduced to a negligibly low level, coming along with a very good uniformity. After the subsequent O2/CHF3-based RIE, a dual damascene opening was successfully formed in parylene-C/Si sample.

AB - We demonstrate a structuring process of a dual damascene opening in parylene-C/Si sample by using hot-embossing combined with etch-back technique. By lowering the initial layer thickness, the residual layer thickness could be reduced to a negligibly low level, coming along with a very good uniformity. After the subsequent O2/CHF3-based RIE, a dual damascene opening was successfully formed in parylene-C/Si sample.

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DO - 10.1109/IMNC.2007.4456230

M3 - 会议稿件

AN - SCOPUS:47349102396

SN - 4990247248

SN - 9784990247249

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SP - 314

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BT - Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC

T2 - s20th International Microprocesses and Nanotechnology Conference, MNC 2007

Y2 - 5 November 2007 through 8 November 2007

ER -

Youn SW, Ueno A, Takahashi M, Maeda R. Microstructuring of dual damascene opening by using hot-embossing combined with etch-back process. In Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC. 2007. p. 314-315. 4456230. (Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC). doi: 10.1109/IMNC.2007.4456230

Microstructuring of dual damascene opening by using hot-embossing combined with etch-back process

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