Abstract
Tungsten (W) thin films were prepared by magnetron sputtering onto Si (100) substrates. Their microstructures were characterized by X-ray diffraction (XRD), field emission scanning electron microscopy (FE-SEM) and transmission electron microscopy (TEM). The hardness and modulus were evaluated by nanoindentation. It is found that a 30 nm Cr sticking layer induces structure changes of deposited W film from β-W to α-W structure. In addition, remarkable hardness enhancement both for the deposited and annealed W films, were compared with that of bulk coarse-grained W, although their nanoindentation modulus is very close to that of corresponding bulk W. The intrinsic reasons that lead to structure changes and super hardness are discussed.
| Original language | English |
|---|---|
| Pages (from-to) | 87-92 |
| Number of pages | 6 |
| Journal | Journal of Materials Science and Technology |
| Volume | 26 |
| Issue number | 1 |
| DOIs | |
| State | Published - Jan 2010 |
Keywords
- Hardness
- Microstructure
- Modulus
- Nanoindentation
- Tungsten film
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