Micro hot embossing for replication of micro structures

X. C. Shan; Y. Murakoshi; R. Maeda

doi:10.1109/IMNC.2002.1178593

Micro hot embossing for replication of micro structures

X. C. Shan
, Y. Murakoshi
, R. Maeda

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

Micro hot embossing is a novel technique for low-cost and mass-production of MEMS components in plastics, and will potentially find wide applications in optical communications and micro fluidics areas. The goal of this research is to develop a micro hot embossing process for high quality pattern transfer from masters to polymer materials. This paper illustrates the architecture design of a hot embossing instrument and process development for micro/nano structure forming. The material used is polycarbonate (PC), and the molds are silicon masters, which are anisotropically etched or deep ICP RIE etched. Replication of micro grooves for passive alignment of optical fibers and micro lenses has been carried out; the results demonstrate technological feasibility and promising suitability of micro/nano hot embossing for low-cost and mass-production of optical communication components.

Original language	English
Title of host publication	2002 International Microprocesses and Nanotechnology Conference, MNC 2002
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	160-161
Number of pages	2
ISBN (Electronic)	4891140313, 9784891140311
DOIs	https://doi.org/10.1109/IMNC.2002.1178593
State	Published - 2002
Externally published	Yes
Event	International Microprocesses and Nanotechnology Conference, MNC 2002 - Tokyo, Japan Duration: 6 Nov 2002 → 8 Nov 2002

Publication series

Name	2002 International Microprocesses and Nanotechnology Conference, MNC 2002

Conference

Conference	International Microprocesses and Nanotechnology Conference, MNC 2002
Country/Territory	Japan
City	Tokyo
Period	6/11/02 → 8/11/02

Access to Document

10.1109/IMNC.2002.1178593

Cite this

Shan, X. C., Murakoshi, Y., & Maeda, R. (2002). Micro hot embossing for replication of micro structures. In 2002 International Microprocesses and Nanotechnology Conference, MNC 2002 (pp. 160-161). Article 1178593 (2002 International Microprocesses and Nanotechnology Conference, MNC 2002). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IMNC.2002.1178593

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title = "Micro hot embossing for replication of micro structures",

abstract = "Micro hot embossing is a novel technique for low-cost and mass-production of MEMS components in plastics, and will potentially find wide applications in optical communications and micro fluidics areas. The goal of this research is to develop a micro hot embossing process for high quality pattern transfer from masters to polymer materials. This paper illustrates the architecture design of a hot embossing instrument and process development for micro/nano structure forming. The material used is polycarbonate (PC), and the molds are silicon masters, which are anisotropically etched or deep ICP RIE etched. Replication of micro grooves for passive alignment of optical fibers and micro lenses has been carried out; the results demonstrate technological feasibility and promising suitability of micro/nano hot embossing for low-cost and mass-production of optical communication components.",

author = "Shan, \{X. C.\} and Y. Murakoshi and R. Maeda",

note = "Publisher Copyright: {\textcopyright} 2002 IEEE.; International Microprocesses and Nanotechnology Conference, MNC 2002 ; Conference date: 06-11-2002 Through 08-11-2002",

year = "2002",

doi = "10.1109/IMNC.2002.1178593",

language = "英语",

series = "2002 International Microprocesses and Nanotechnology Conference, MNC 2002",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "160--161",

booktitle = "2002 International Microprocesses and Nanotechnology Conference, MNC 2002",

}

Shan, XC, Murakoshi, Y & Maeda, R 2002, Micro hot embossing for replication of micro structures. in 2002 International Microprocesses and Nanotechnology Conference, MNC 2002., 1178593, 2002 International Microprocesses and Nanotechnology Conference, MNC 2002, Institute of Electrical and Electronics Engineers Inc., pp. 160-161, International Microprocesses and Nanotechnology Conference, MNC 2002, Tokyo, Japan, 6/11/02. https://doi.org/10.1109/IMNC.2002.1178593

Micro hot embossing for replication of micro structures. / Shan, X. C.; Murakoshi, Y.; Maeda, R.
2002 International Microprocesses and Nanotechnology Conference, MNC 2002. Institute of Electrical and Electronics Engineers Inc., 2002. p. 160-161 1178593 (2002 International Microprocesses and Nanotechnology Conference, MNC 2002).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Micro hot embossing for replication of micro structures

AU - Shan, X. C.

AU - Murakoshi, Y.

AU - Maeda, R.

PY - 2002

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N2 - Micro hot embossing is a novel technique for low-cost and mass-production of MEMS components in plastics, and will potentially find wide applications in optical communications and micro fluidics areas. The goal of this research is to develop a micro hot embossing process for high quality pattern transfer from masters to polymer materials. This paper illustrates the architecture design of a hot embossing instrument and process development for micro/nano structure forming. The material used is polycarbonate (PC), and the molds are silicon masters, which are anisotropically etched or deep ICP RIE etched. Replication of micro grooves for passive alignment of optical fibers and micro lenses has been carried out; the results demonstrate technological feasibility and promising suitability of micro/nano hot embossing for low-cost and mass-production of optical communication components.

AB - Micro hot embossing is a novel technique for low-cost and mass-production of MEMS components in plastics, and will potentially find wide applications in optical communications and micro fluidics areas. The goal of this research is to develop a micro hot embossing process for high quality pattern transfer from masters to polymer materials. This paper illustrates the architecture design of a hot embossing instrument and process development for micro/nano structure forming. The material used is polycarbonate (PC), and the molds are silicon masters, which are anisotropically etched or deep ICP RIE etched. Replication of micro grooves for passive alignment of optical fibers and micro lenses has been carried out; the results demonstrate technological feasibility and promising suitability of micro/nano hot embossing for low-cost and mass-production of optical communication components.

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DO - 10.1109/IMNC.2002.1178593

M3 - 会议稿件

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T3 - 2002 International Microprocesses and Nanotechnology Conference, MNC 2002

SP - 160

EP - 161

BT - 2002 International Microprocesses and Nanotechnology Conference, MNC 2002

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - International Microprocesses and Nanotechnology Conference, MNC 2002

Y2 - 6 November 2002 through 8 November 2002

ER -

Micro hot embossing for replication of micro structures

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