TY - GEN
T1 - Mems piezoelectric vibration energy harvester with in-plane pzt bimorph
AU - Wang, Lu
AU - Zhao, Libo
AU - Jiang, Zhuangde
AU - Li, Xiang
AU - Chen, Zihang
AU - Ryutaro, Maeda
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/4
Y1 - 2019/4
N2 - In order to overcome the drawbacks of conventional-plane vibration MEMS-PVEH. We have presented an in-plane vibration MEMS-PVEH with bimorph PZT by bonding bulk PZT. Performance of two kinds of PVEHs were studied by finite element method using COMSOL software. Including vibration modes, resonant frequencies, open circuit voltage, peak power, optimal resistance, and the static stress at gravity load of the structure. Compare to the conventional-plane vibration PVEH, the proposed in-plane vibration PVEH has lower resonant frequency of 122 Hz, higher peak power of 50 μW. It has advantages of heavier proof mass, good performance PZT bimorph, thinner cantilever thickness, convenient electrodes lead, and has the frame to protect the oscillator. Besides, in-plane vibration PVEH is convenient to be fabricated by planar graphical MEMS process.
AB - In order to overcome the drawbacks of conventional-plane vibration MEMS-PVEH. We have presented an in-plane vibration MEMS-PVEH with bimorph PZT by bonding bulk PZT. Performance of two kinds of PVEHs were studied by finite element method using COMSOL software. Including vibration modes, resonant frequencies, open circuit voltage, peak power, optimal resistance, and the static stress at gravity load of the structure. Compare to the conventional-plane vibration PVEH, the proposed in-plane vibration PVEH has lower resonant frequency of 122 Hz, higher peak power of 50 μW. It has advantages of heavier proof mass, good performance PZT bimorph, thinner cantilever thickness, convenient electrodes lead, and has the frame to protect the oscillator. Besides, in-plane vibration PVEH is convenient to be fabricated by planar graphical MEMS process.
KW - In-plane vibration
KW - MEMS
KW - PVEH
KW - PZT
KW - Resonant frequency
UR - https://www.scopus.com/pages/publications/85076683092
U2 - 10.1109/NEMS.2019.8915611
DO - 10.1109/NEMS.2019.8915611
M3 - 会议稿件
AN - SCOPUS:85076683092
T3 - Proceedings of the 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019
SP - 355
EP - 359
BT - Proceedings of the 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019
Y2 - 11 April 2019 through 14 April 2019
ER -