Measurement study of residual stress on tungsten-rhenium thin film thermocouples by nanoindentation technology

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Abstract

In this paper, Nano-indentation technology is used to test the mechanical property of the tungsten-rhenium thin film, including hardness, elastic modulus and residual stress. The effects of different heat treatment temperature and different substrates on the hardness and elastic modulus of tungsten-rhenium films were studied. We research three substrates which are silicon carbide ceramic, aluminum oxide ceramic and zirconium oxide ceramic. Test results show that the tungsten-rhenium films on aluminum oxide ceramic shows the biggest values of elastic modulus and the smallest on silicon carbide ceramic. However, value of hardness is biggest on zirconium oxide ceramic and smallest on aluminum oxide ceramic. Besides, the heat treatment temperature has high influence on hardness and elastic modulus of tungsten-rhenium film. And under different substrates, the hardness and elastic modulus of film on zirconium oxide ceramic is the most sensitive to heat treatment temperature. By contrast, silicon carbide ceramic is the least.

Original languageEnglish
Title of host publication2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages800-803
Number of pages4
ISBN (Electronic)9781509030590
DOIs
StatePublished - 25 Aug 2017
Event12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017 - Los Angeles, United States
Duration: 9 Apr 201712 Apr 2017

Publication series

Name2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017

Conference

Conference12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017
Country/TerritoryUnited States
CityLos Angeles
Period9/04/1712/04/17

Keywords

  • Residual stress
  • Temperature sensor
  • TFTCs

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