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Measurement and analysis of insertion loss in an optical collimation system designed for A 2D MEMS optical switch

  • National Institute of Advanced Industrial Science and Technology
  • Agency for Science, Technology and Research, Singapore

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

A 2D optical switch system using two ball lenses as a collimator was theoretically analyzed with the objective of minimizing optical insertion loss. The lens diameters, lens material, path length, and alignment tolerance were optimized for use with small MEMS mirrors and a relatively long (> 10 mm) path length. The insertion loss was calculated by the ray tracing method. The optimum lens diameter was determined by a balance of lens aberration and beam diameter. Insertion loss measurements of the optical system were performed without the use of a MEMS mirror. Those measurement results exhibited tendencies similar to the calculations. Measurements using a MEMS mirror were also performed and the insertion loss is discussed regarding the involvement of the optical system and mirror surface.

Original languageEnglish
Title of host publicationProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
Subtitle of host publicationAdvances in Electronic Packaging 2005
PublisherAmerican Society of Mechanical Engineers
Pages767-772
Number of pages6
ISBN (Print)0791842002, 9780791842003
DOIs
StatePublished - 2005
Externally publishedYes
EventASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA, United States
Duration: 17 Jul 200522 Jul 2005

Publication series

NameProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
VolumePART A

Conference

ConferenceASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
Country/TerritoryUnited States
CitySan Francisco, CA
Period17/07/0522/07/05

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