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Mass fabrication of 4H-SiC high temperature pressure sensors by femtosecond laser etching

  • Lukang Wang
  • , You Zhao
  • , Yulong Zhao
  • , Yu Yang
  • , Bo Li
  • , Taobo Gong
  • Xi'an Jiaotong University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

6 Scopus citations

Abstract

4H Silicon carbide (4H-SiC) is one of the most promising materials for pressure sensing in harsh environments. Due to the low efficiency and high energy consumption of dry etching process, mass manufacturing of SiC pressure sensors has always been a challenging problem. A Yb:KGW femtosecond laser was used to perform the circular diaphragms of bulk 4H-SiC by parallel straight line scanning. Small dimension errors and low surface roughness in rapid etching process were measured. This indicates the potential of utilising the femtosecond laser scanning approach to mass-fabricate bulk SiC sensor chips for pressure sensing.

Original languageEnglish
Title of host publicationProceedings of the 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1478-1481
Number of pages4
ISBN (Electronic)9781665419413
DOIs
StatePublished - 25 Apr 2021
Event16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021 - Xiamen, China
Duration: 25 Apr 202129 Apr 2021

Publication series

NameProceedings of the 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021

Conference

Conference16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021
Country/TerritoryChina
CityXiamen
Period25/04/2129/04/21

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

  1. SDG 7 - Affordable and Clean Energy
    SDG 7 Affordable and Clean Energy

Keywords

  • 4H-SiC
  • femtosecond laser
  • mass fabrication
  • pressure sensor

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