Skip to main navigation Skip to search Skip to main content

Length-scale-dependent deformation mechanism of Cu/X (X=Ru, W) multilayer thin films

  • Q. Zhou
  • , Y. Li
  • , F. Wang
  • , P. Huang
  • , T. J. Lu
  • , K. W. Xu

Research output: Contribution to journalArticlepeer-review

22 Scopus citations

Abstract

The microstructure and deformation/strengthening behavior of Cu/Ru (face-centered cubic (fcc)/hexagonal close-packed) and Cu/Cr (fcc/body-centered cubic) multilayered films with equal individual layer thickness h ranging from 0.8 to 200 nm were investigated. Based on systematic X-ray diffraction and transmission electron microscopy analyses, as h was varied, interface structure transitions from semi-coherent to fully coherent structures were observed in Cu/Ru rather than Cu/W. These structure transitions were found to play crucial roles in length-scale dependent strengthening mechanisms. Specifically, the multilayer strength derived for relatively large h (≥50. nm) followed the classic Hall-Petch relation, while the load-bearing effect was proposed to be the dominant mechanism for relatively small h (50. nm. ≥. h≥. 4. nm). More importantly, as h was further reduced to below 4 nm in Cu/Ru, a strengthening mechanism based on dislocation loop crossing several coherent interfaces was proposed and quantitatively evaluated, The number of layers needed to be crossed by the dislocation loop was found to determine the strength.

Original languageEnglish
Pages (from-to)206-214
Number of pages9
JournalMaterials Science and Engineering: A
Volume664
DOIs
StatePublished - 10 May 2016

Keywords

  • Interface structure
  • Multilayer
  • Nanoindentation
  • Strength

Fingerprint

Dive into the research topics of 'Length-scale-dependent deformation mechanism of Cu/X (X=Ru, W) multilayer thin films'. Together they form a unique fingerprint.

Cite this