Investigation on multidimensional test vehicle for embedded microfluidic cooling performance evaluation

As the critical dimension size of integrated circuits continues to decrease, the integration density increases dramatically, and they are facing sever heat dissipation challenges. Embedding microfluidic structure directly inside the chip is a promising approach for eliminating the relatively large heat fluxes in interlayer configurations. Considerable research efforts have been devoted to the design and optimization to obtain better cooling performance. Although the previous work analyzed the embedded cooling from different aspects, there are common points in the research contents. This paper refined the common contents in the research and proposed a multidimensional test vehicle. It can not only predict the thermal behavior of different electronic devices, but also evaluate cooling schemes composed of various microfluidic and manifold structures.The results show that the test vehicle can eliminate up to 5.4 kW/cm² of heat flux within 1 mm², and control the total thermal resistance under 0.076 K·cm²/W. Therefore, the multidimensional test vehicle provides a useful tool for evaluating the thermo-hydraulic performance of embedded microfluidic cooling. Moreover, it offers a research method for improving the cooling potential through the integration of microfluidics and thermal analysis.