Investigation of dielectric and thermal conductive properties of epoxy resins modified by core-shell structured PS@SiO2

Jun Zhou; Yingye Jiang; Gaoqing Wu; Weijian Wu; Yang Wang; Kai Wu; Yonghong Cheng

doi:10.1016/j.compositesa.2017.03.005

Investigation of dielectric and thermal conductive properties of epoxy resins modified by core-shell structured PS@SiO₂

Jun Zhou
, Yingye Jiang
, Gaoqing Wu
, Weijian Wu
, Yang Wang
, Kai Wu
, Yonghong Cheng

School of Electrical Engineering

Research output: Contribution to journal › Article › peer-review

27 Scopus citations

Abstract

In this study, the core-shell structured polystyrene@SiO₂ (PS@SiO₂) microspheres were successfully synthesized by tetraethylorthosilicate (TEOS) hydrolysis method. The synthesized PS@SiO₂ microspheres were subsequently characterized by FTIR spectroscopy, XRD, SEM, and TEM respectively. The results indicated that the particle size of PS@SiO₂ microspheres is about 2 μm, and the PS microsphere is uniformly coated by amorphous SiO₂ shell. PS@SiO₂/cyanate ester (CE)/epoxy resin (ER) composite films were prepared with PS@SiO₂ microspheres as fillers and morphology of the films was inspected by AFM. The images showed that the PS@SiO₂ microspheres were well-distributed in epoxy matrix. Thermal conductivity of PS@SiO₂/CE/ER composite increases 131% by adding 1.0 wt% of PS@SiO₂ microspheres. The volume resistivity of composites decreased with increasing of the loading of PS@SiO₂ fillers and still keeping an excellent insulating performance. In addition, the dielectric constant as well as the dielectric loss of composites increased with the increased the content of PS@SiO₂ microspheres.

Original language	English
Pages (from-to)	76-82
Number of pages	7
Journal	Composites Part A: Applied Science and Manufacturing
Volume	97
DOIs	https://doi.org/10.1016/j.compositesa.2017.03.005
State	Published - 1 Jun 2017

Keywords

CE/ER matrix
Dielectric property
PS@SiO microspheres
Thermal conductivity

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10.1016/j.compositesa.2017.03.005

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title = "Investigation of dielectric and thermal conductive properties of epoxy resins modified by core-shell structured PS@SiO2",

abstract = "In this study, the core-shell structured polystyrene@SiO2 (PS@SiO2) microspheres were successfully synthesized by tetraethylorthosilicate (TEOS) hydrolysis method. The synthesized PS@SiO2 microspheres were subsequently characterized by FTIR spectroscopy, XRD, SEM, and TEM respectively. The results indicated that the particle size of PS@SiO2 microspheres is about 2 μm, and the PS microsphere is uniformly coated by amorphous SiO2 shell. PS@SiO2/cyanate ester (CE)/epoxy resin (ER) composite films were prepared with PS@SiO2 microspheres as fillers and morphology of the films was inspected by AFM. The images showed that the PS@SiO2 microspheres were well-distributed in epoxy matrix. Thermal conductivity of PS@SiO2/CE/ER composite increases 131\% by adding 1.0 wt\% of PS@SiO2 microspheres. The volume resistivity of composites decreased with increasing of the loading of PS@SiO2 fillers and still keeping an excellent insulating performance. In addition, the dielectric constant as well as the dielectric loss of composites increased with the increased the content of PS@SiO2 microspheres.",

keywords = "CE/ER matrix, Dielectric property, PS@SiO microspheres, Thermal conductivity",

author = "Jun Zhou and Yingye Jiang and Gaoqing Wu and Weijian Wu and Yang Wang and Kai Wu and Yonghong Cheng",

note = "Publisher Copyright: {\textcopyright} 2017 Elsevier Ltd",

year = "2017",

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doi = "10.1016/j.compositesa.2017.03.005",

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T1 - Investigation of dielectric and thermal conductive properties of epoxy resins modified by core-shell structured PS@SiO2

AU - Zhou, Jun

AU - Jiang, Yingye

AU - Wu, Gaoqing

AU - Wu, Weijian

AU - Wang, Yang

AU - Wu, Kai

AU - Cheng, Yonghong

PY - 2017/6/1

Y1 - 2017/6/1

N2 - In this study, the core-shell structured polystyrene@SiO2 (PS@SiO2) microspheres were successfully synthesized by tetraethylorthosilicate (TEOS) hydrolysis method. The synthesized PS@SiO2 microspheres were subsequently characterized by FTIR spectroscopy, XRD, SEM, and TEM respectively. The results indicated that the particle size of PS@SiO2 microspheres is about 2 μm, and the PS microsphere is uniformly coated by amorphous SiO2 shell. PS@SiO2/cyanate ester (CE)/epoxy resin (ER) composite films were prepared with PS@SiO2 microspheres as fillers and morphology of the films was inspected by AFM. The images showed that the PS@SiO2 microspheres were well-distributed in epoxy matrix. Thermal conductivity of PS@SiO2/CE/ER composite increases 131% by adding 1.0 wt% of PS@SiO2 microspheres. The volume resistivity of composites decreased with increasing of the loading of PS@SiO2 fillers and still keeping an excellent insulating performance. In addition, the dielectric constant as well as the dielectric loss of composites increased with the increased the content of PS@SiO2 microspheres.

AB - In this study, the core-shell structured polystyrene@SiO2 (PS@SiO2) microspheres were successfully synthesized by tetraethylorthosilicate (TEOS) hydrolysis method. The synthesized PS@SiO2 microspheres were subsequently characterized by FTIR spectroscopy, XRD, SEM, and TEM respectively. The results indicated that the particle size of PS@SiO2 microspheres is about 2 μm, and the PS microsphere is uniformly coated by amorphous SiO2 shell. PS@SiO2/cyanate ester (CE)/epoxy resin (ER) composite films were prepared with PS@SiO2 microspheres as fillers and morphology of the films was inspected by AFM. The images showed that the PS@SiO2 microspheres were well-distributed in epoxy matrix. Thermal conductivity of PS@SiO2/CE/ER composite increases 131% by adding 1.0 wt% of PS@SiO2 microspheres. The volume resistivity of composites decreased with increasing of the loading of PS@SiO2 fillers and still keeping an excellent insulating performance. In addition, the dielectric constant as well as the dielectric loss of composites increased with the increased the content of PS@SiO2 microspheres.

KW - CE/ER matrix

KW - Dielectric property

KW - PS@SiO microspheres

KW - Thermal conductivity

UR - https://www.scopus.com/pages/publications/85014826853

U2 - 10.1016/j.compositesa.2017.03.005

DO - 10.1016/j.compositesa.2017.03.005

M3 - 文章

AN - SCOPUS:85014826853

SN - 1359-835X

VL - 97

SP - 76

EP - 82

JO - Composites Part A: Applied Science and Manufacturing

JF - Composites Part A: Applied Science and Manufacturing

ER -

Investigation of dielectric and thermal conductive properties of epoxy resins modified by core-shell structured PS@SiO₂

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Keywords

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