Integrated micro Pirani gauge based hermetical package monitoring for uncooled VO _x bolometer FPAs

This paper presents the design and fabrication of a micro Pirani gauge using VO _x as the sensitive material for monitoring the pressure inside a hermetical package for micro bolometer focal plane arrays (FPAs). The designed Pirani gauge working in heat dissipating mode was intentionally fabricated using standard MEMS processing which is highly compatible with the FPAs fabrication. The functional layer of the micro Pirani gauge is a VO _x thin film designed as a 100 × 200 μm pixel, suspended 2 μm above the substrate. By modeling of rarefied gas heat conduction using the Extended Fourier's law, finite element analysis is used to investigate the sensitivity of the pressure gauge. Also the thermal interactions between the micro Pirani gauge and bolometer FPAs are verified. From the fabricated prototype, the measured device TCR is about -0.8% K^-1 and the sensitivity about 1.84 × 10^-3W K^-1 mbar ^-1.