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Influence of moisture contents with a low value below 1500μL/L on SF6 decomposition characteristics

  • Lipeng Zhong
  • , Shengchang Ji
  • , Kai Liu
  • , Lingyu Zhu
  • , Qing Xiong
  • , Xue Xing
  • , Yuanyuan Wang
  • , Haibo Huang
  • Xi'an Jiaotong University
  • State Grid Corporation of China

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

There inevitably exists trace level of water in the SF6 insulated equipment. Previous research has shown that the decomposition characteristics of SF6 has close relationship with the moisture content. In order to study the influence of moisture under low volume fraction on discharge and decomposition characteristics of SF6. An experimental and testing platform for SF6 gas-insulated electrical equipment was designed in this paper under different moisture contents (147 μL/L, 347 μL/L, 681 μL/L, 909 μL/L, and 1340 μL/L). The influence of moisture on the magnitude of partial discharge caused by metal protrusions defect as well as the content variation of SOF2, SO2F2, SO2, CO2 were observed in detail. The results indicate that average discharge amount and overall magnitude of charge decrease first and then increase with the increasing volume fraction of moisture. The quantitative ordering of the decomposition products is found to be SOF2 > SO2F2 > CO2 > SO2. H2O will promote the formation of all the four products, with a stronger influence on the sulfur-containing products than CO2. Besides, the value of φ(SOF2+SO2+SO2F2)/φ(CO2) presents overall increasing trend with moisture content. It ultimately increases to a stable value about 2.5-3 under low moisture condition (<681 μL/L). The value of φ(SO2F2)/φ(SOF2+SO2) maintains stable with the variation of moisture. It is about 0.13-0.3 under low moisture content. Thus, the detection method of SF6 decomposition products should be utilized with the consideration of moisture content.

Original languageEnglish
Title of host publication2016 IEEE International Power Modulator and High Voltage Conference, IPMHVC 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages315-319
Number of pages5
ISBN (Electronic)9781509023547
DOIs
StatePublished - 17 Aug 2017
Event2016 IEEE International Power Modulator and High Voltage Conference, IPMHVC 2016 - San Francisco, United States
Duration: 5 Jul 20169 Jul 2016

Publication series

Name2016 IEEE International Power Modulator and High Voltage Conference, IPMHVC 2016

Conference

Conference2016 IEEE International Power Modulator and High Voltage Conference, IPMHVC 2016
Country/TerritoryUnited States
CitySan Francisco
Period5/07/169/07/16

Keywords

  • Decomposition characteristics
  • Metal protrusions defect
  • Moisture contents
  • Partial discharge
  • SF

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