Abstract
The microstructure of carbon nanotube reinforced copper matrix (CNT/Cu) nanocomposites, processed by molecular-level mixing, exhibits CNTs homogeneously dispersed in the Cu matrix. Measured thermal conductivity of the fabricated CNT/Cu nanocomposites decreased as the CNT volume fraction increased from 5% to 10%. A low coefficient of thermal expansion (CTE) was obtained from the 10 vol.% CNT/Cu nanocomposite. These results indicate that embedded CNTs provide CNT/metal interfaces as thermal barriers but also stiffen the metal matrix composites.
| Original language | English |
|---|---|
| Pages (from-to) | 181-184 |
| Number of pages | 4 |
| Journal | Scripta Materialia |
| Volume | 64 |
| Issue number | 2 |
| DOIs | |
| State | Published - Jan 2011 |
Keywords
- Carbon and graphite
- Metal matrix composites
- Nanocomposite
- Thermal conductivity
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